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首页> 外文期刊>Active and passive electronic components >Anomalous DIBL Effect in Fully Depleted SOI MOSFETs Using Nanoscale Gate-Recessed Channel Process
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Anomalous DIBL Effect in Fully Depleted SOI MOSFETs Using Nanoscale Gate-Recessed Channel Process

机译:使用纳米级栅凹槽工艺的全耗尽SOI MOSFET的异常DIBL效应

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Nanoscale Gate-Recessed Channel (GRC) Fully Depleted- (FD-) SOI MOSFET device with a silicon channel thickness (tSi) as low as 2.2 nm was first tested at room temperature for functionality check and then tested at low temperature (77 K) forI-Vcharacterizations. In spite of its FD-SOI nanoscale thickness and long channel feature, the device has surprisingly exhibited a Drain-Induced Barrier Lowering (DIBL) effect at RT. However, this effect was suppressed at 77 K. If the apparition of such anomalous effect can be explained by a parasitic short channel transistor located at the edges of the channel, its suppression is explained by the decrease of the potential barrier between the drain and the channel when lowering the temperature.
机译:硅沟道厚度(tSi)低至2.2 nm的纳米级栅极凹槽(GRC)全耗尽(FD-)SOI MOSFET器件首先在室温下进行功能检查,然后在低温(77 K)下进行测试I-V特性。尽管具有FD-SOI纳米级的厚度和长通道特性,该器件仍在RT上出人意料地表现出漏极诱导的势垒降低(DIBL)效应。但是,这种效应在77 K时得到了抑制,如果这种异常效应的出现可以通过位于沟道边缘的寄生短沟道晶体管来解释,则其抑制作用可以通过减小漏极和漏极之间的势垒来解释。降低温度时的通道。

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