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Large Within-Die Gate Delay Variations in Sub-Threshold Logic Circuits at Low Temperature

机译:低温下亚阈值逻辑电路中的大芯片内栅极延迟变化

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摘要

Temperature dependence of 256 within-die random gate delay variations in sub-threshold logic circuits is measured in 40-nm CMOS test chips. When the temperature is reduced from 25$^{ circ}hbox{C}$ to $-40^{circ}hbox{C}$, the sigma/average $(sigma/mu)$ of the gate delay at 0.3 V increases by 1.4 times. A newly developed model shows that $sigma/mu$ of the gate delay is proportional to $1/T$ for the first time, where $T$ is the absolute temperature.
机译:在40 nm CMOS测试芯片中测量了亚阈值逻辑电路中256个管芯内随机栅极延迟变化的温度依赖性。当温度从25 $ hbox {C} $降低到$ -40 ^ {circ} hbox {C} $时,栅极延迟在0.3 V时的sigma /平均值$(sigma / mu)$ 1.4倍新开发的模型显示,门延迟的$ sigma / mu $首次与$ 1 / T $成比例,其中$ T $是绝对温度。

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