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Analysis of carrier generation lifetime in strained-Si/SiGe heterojunction MOSFETs from capacitance transient

机译:从电容瞬态分析应变Si / SiGe异质结MOSFET中载流子产生寿命

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Carrier generation lifetime (tau(g)) in strained-Si/SiGe has been investigated using capacitance transient method in MOS structure. Interface properties of thermally grown gate oxide on strained-Si/SiGe has been studied prior to transient capacitance measurements. Average midgap value of interface state density (D-it) extracted from quasi-static CV measurement is around 2 x 10(10) to 5 x 10(10) cm(-2) eV(-1) for both strained-Si and bulk-Si samples. The observed non-linear behavior of capacitance transient characteristics for strained-Si/SiGe heterostructure are due to the carrier confinement in the potential wells caused by virtue of the valence band and conduction band discontinuities. Generation lifetime in strained-Si and SiGe buffer layer estimated from the segments of Zerbst plot having different slopes. The value of generation lifetime in strained-Si, SiGe buffer and co-processed bulk-Si is ranges from 120 to 170 mus, 20 to 90 mus and 177 mus, respectively. (C) 2003 Elsevier B.V. All rights reserved. [References: 18]
机译:在MOS结构中,采用电容瞬态方法研究了应变Si / SiGe中的载流子产生寿命(tau(g))。在瞬态电容测量之前,已经研究了在应变Si / SiGe上热生长的栅氧化物的界面特性。从准静态CV测量中提取的界面态密度(D-it)的平均中间能隙值在应变Si和应变Si均约为2 x 10(10)至5 x 10(10)cm(-2)eV(-1)左右。体硅样品。观察到的应变Si / SiGe异质结构电容瞬态特性的非线性行为是由于价带和导带不连续性导致载流子限制在势阱中。从具有不同斜率的Zerbst图的各段估计的应变Si和SiGe缓冲层中的生成寿命。在应变硅,SiGe缓冲液和共处理的块状硅中,生成寿命的值分别为120到170亩,20到90亩和177亩。 (C)2003 Elsevier B.V.保留所有权利。 [参考:18]

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