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Measurement of minority carrier lifetimes in nanocrystalline silicon devices using reverse-recovery transient method.

机译:使用反向恢复瞬态方法测量纳米晶硅器件中少数载流子的寿命。

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摘要

A new technique for measuring minority carrier lifetimes in p-i-n device configurations, and is used to measure the effective hole lifetimes in nanocrystalline silicon materials. The technique is the reverse-recovery transient method. A forward current in a p-n junction is suddenly switched, and a high constant reverse current flows for a certain period of time. This time is related to the time the injected minority carriers take to recombine in the base. The technique allows for analysis of hole lifetimes in typical thin film nanocrystalline silicon device with very common testing equipment.;The samples used for testing were fabricated using VHF-PECVD reactors using silane and hydrogen as source gases. Both hydrogen profiled nanocrystalline silicon and superlattice nanocrystalline silicon devices were fabricated. The shallow and deep donor states were measured using a junction capacitance technique. The minority carrier diffusion length was determined using a combination of capacitance and quantum efficiency techniques.;The measured hole lifetimes was seen to range from 200-600 ns. Lifetimes were plotted versus inverse defect density, and a linear correlation was seen. This showed the lifetimes followed the Shockley-Read-Hall recombination model. It was also seen for devices deposited at high temperature that a final hydrogen plasma treatment or hydrogen anneal step, the lifetimes and diffusion lengths improved, possibly due to grain boundary passivation. Finally, it was shown that lifetimes in superlattice devices correlated with defect density and diffusion lengths indicating transport in these samples is the same as hydrogen profiled samples.;This technique has been demonstrated for the first time in nanocrystalline silicon devices. An advantage to measuring lifetimes with this technique is that the actual device was not modified in any way to accommodate the measurement. Also, the method only required equipment that can be found in any common electronics lab.
机译:一种测量p-i-n器件配置中少数载流子寿命的新技术,用于测量纳米晶硅材料中的有效空穴寿命。该技术是反向恢复瞬态方法。 p-n结中的正向电流突然切换,并且高恒定的反向电流流动一定时间。此时间与注入的少数载流子在基地重组所需的时间有关。该技术允许使用非常普通的测试设备分析典型薄膜纳米晶体硅器件中的空穴寿命。;用于测试的样品是使用VHF-PECVD反应器(使用硅烷和氢气作为原料气)制造的。氢异型纳米晶硅和超晶格纳米晶硅器件均被制造。使用结电容技术测量浅和深施主态。结合载流子和量子效率技术确定了少数载流子的扩散长度。测得的空穴寿命为200-600 ns。将寿命与缺陷密度的倒数作图,并观察到线性相关性。这表明寿命遵循了Shockley-Read-Hall重组模型。还可以看出,对于在高温下沉积的器件,最终的氢等离子体处理或氢退火步骤可以改善寿命和扩散长度,这可能是由于晶界钝化所致。最后,表明超晶格器件的寿命与缺陷密度和扩散长度相关,表明这些样品中的迁移与氢剖面样品相同。该技术首次在纳米晶硅器件中得到证明。使用此技术测量寿命的一个优势是,实际设备没有进行任何修改以适应测量。而且,该方法仅需要在任何普通电子实验室中都能找到的设备。

著录项

  • 作者

    Reusswig, Philip David.;

  • 作者单位

    Iowa State University.;

  • 授予单位 Iowa State University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 M.S.
  • 年度 2008
  • 页码 46 p.
  • 总页数 46
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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