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Influence of GaN Stress on Threshold Voltage Shift in AlGaN/GaN High-Electron-Mobility Transistors on Si under Off-State Electrical Bias

机译:GaN应力对关态偏压下Si上AlGaN / GaN高电子迁移率晶体管的阈值电压漂移的影响

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The change in threshold voltage (Vth) in AIGaN/GaN high-electron-mobility transistors (HEMTs) on Si occurs during off-state bias stress.Raman spectroscopy shows that the GaN strain/stress changes with the increase in buffer and i-GaN thicknesses.Our results revealed that there is a strong correlation between the Vth shift and GaN strain/stress.The Vth shifts positively and negatively, respectively, for biaxial tensile and compressive strains.We observed minimal device degradation with the negligible l/th shift before and after off-state bias stress for the strain relieved sample.The results illustrate the importance of GaN strain/stress for the degradation and reliability of AIGaN/GaN HEMTs.
机译:Si上的AIGaN / GaN高电子迁移率晶体管(HEMT)中的阈值电压(Vth)发生在关态偏置应力期间。拉曼光谱显示GaN应变/应力随缓冲液和i-GaN的增加而变化结果表明,Vth偏移与GaN应变/应力之间存在很强的相关性.Vth偏移对于双轴拉伸和压缩应变分别为正和负。结果表明了GaN应变/应力对于AIGaN / GaN HEMT的退化和可靠性的重要性。

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  • 来源
    《_Applied Physics Express》 |2013年第8期|086504.1-086504.4|共4页
  • 作者单位

    Research Center for Nano-Device and System, Nagoya Institute of Technology, Nagoya 466-8555, Japan;

    Research Center for Nano-Device and System, Nagoya Institute of Technology, Nagoya 466-8555, Japan;

    Research Center for Nano-Device and System, Nagoya Institute of Technology, Nagoya 466-8555, Japan;

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