Ultra CSP/sup TM/-a wafer level package

摘要

There has been a significant amount of work over the past five years on chip scale packaging. The majority of this work has been an extension of conventional integrated circuit (IC) packaging technology utilizing either wire bonders or tape automated bonding (TAB)-type packaging technology. Handling discrete devices during the IC packaging for these type of chip scale packages (CSPs) has resulted in a relatively high cost for these packages. This paper reports a true wafer level packaging (WLP) technology called the Ultra CSP/sup TM/. One advantage of this WLP concept is that it uses standard IC processing technology for the majority of the package manufacturing. This makes the Ultra CSP ideal for both insertion at the end of the wafer fab as well as the facilitation of wafer level test and burn-in options. This is especially true for dynamic random access memory (DRAM) wafers. Wafer level burn-in and wafer level processing can be used for DRAM and other devices as a way to both reduce cost and improve cycle time. Thermal cycling results for Ultra CSPs with a variety of package sizes and input/output (I/O) counts are presented. These test vehicles, assembled to FR-4 boards without underfill, cover a range of footprints typical of flash memory, DRAM and other devices. The electrical and thermal performance characteristics of the Ultra CSP package technology are discussed.