A Novel Positive Working Photosensitive Polyimide For Wafer-level CSP Packages

摘要

Polyimide has been applied to buffer coatings of the semiconductor devices and interlayer of multi-layer circuit board because of its good heat ressiance and solvent resistance. Photosensitive polyimide (PSPI) has been very useful to simplify the polyimide patterning process. Positive tone PSPI was required to achieve fine polyimide patterns on the semiconductor chips. We have already provided positive working PSPI, PW-1000. [1] The PW-1000 exhibits excellent properties for semiconductor buffer coatings.