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Tuning of strain and surface roughness of porous silicon layers for higher-quality seeds for epitaxial growth

机译:调整用于外延生长的高质量种子的多孔硅层的应变和表面粗糙度

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摘要

Sintered porous silicon is a well-known seed for homo-epitaxy that enables fabricating transferrable monocrystalline foils. The crystalline quality of these foils depends on the surface roughness and the strain of this porous seed, which should both be minimized. In order to provide guidelines for an optimum foil growth, we present a systematic investigation of the impact of the thickness of this seed and of its sintering time prior to epitaxial growth on strain and surface roughness. Strain and surface roughness were monitored in monolayers and double layers with different porosities as a function of seed thickness and of sintering time by high-resolution X-ray diffraction and profilometry, respectively. Unexpectedly, we found that strain in double and monolayers evolves in opposite ways with respect to layer thickness. This suggests that an interaction between layers in multiple stacks is to be considered. We also found that if higher seed thickness and longer annealing time are to be preferred to minimize the strain in double layers, the opposite is required to achieve smoother layers. The impact of these two parameters may be explained by considering the morphological evolution of the pores upon sintering and, in particular, the disappearance of interconnections between the porous seed and the bulk as well as the enlargement of pores near the surface. An optimum epitaxial growth hence calls for a trade-off in seed thickness and annealing time, between minimum-strained layers and rougher surfaces.PACS codes81.40.-z Treatment of materials and its effects on microstructure, nanostructure, and properties; 81.05.Rm Porous materials; granular materials; 82.80.Ej X-ray, Mössbauer and other γ-ray spectroscopic analysis methods
机译:烧结多孔硅是众所周知的均质外延晶种,能够制造可转移的单晶箔。这些箔的结晶质量取决于该多孔种子的表面粗糙度和应变,这两者均应最小化。为了提供最佳箔生长的指导,我们对这种种子的厚度及其在外延生长之前的烧结时间对应变和表面粗糙度的影响进行了系统的研究。分别通过高分辨率X射线衍射和轮廓测量法,在具有不同孔隙率的单层和双层中,根据种子厚度和烧结时间监测应变和表面粗糙度。出乎意料的是,我们发现双层和单层应变相对于层厚度以相反的方式演变。这表明要考虑多个堆栈中各层之间的交互作用。我们还发现,如果最好采用较高的晶种厚度和较长的退火时间以最大程度地减小双层中的应变,则需要相反的操作以实现较光滑的层。这两个参数的影响可以通过考虑孔在烧结时的形态演变来解释,特别是考虑到多孔种子与主体之间互连的消失以及表面附近孔的扩大。因此,最佳的外延生长需要在最小应变层和较粗糙表面之间权衡种子厚度和退火时间。PACS代码81.40.-z材料的处理及其对微结构,纳米结构和性能的影响; 81.05.Rm多孔材料;粒状材料; 82.80。Ej X射线,Mössbauer和其他γ射线光谱分析方法

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