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Improvement of seed layer smoothness for epitaxial growth on porous silicon

机译:改善在多孔硅上外延生长的种子层光滑度

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摘要

In the last decades many techniques have been proposed to manufacture thin (<50μm) silicon solar cells. The main issues in manufacturing thin solar cells are the unavailability of a reliable method to produce thin silicon foils with contained material losses (kerf-losses) and the difficulties in handling and processing such fragile foils. A way to solve both issues is to grow an epitaxial foil on top of a weak sintered porous silicon layer. The porous silicon layer is formed by electrochemical etching on a thick silicon substrate and then annealed to close the top surface. This surface is employed as seed layer for the epitaxial growth of a silicon layer which can be partially processed while attached on the substrate that provides mechanical support. Afterward, the foil can be bonded on glass, detached and further processed at module level. The efficiency of the final solar cell will depend on the quality of the epitaxial layer which, in turn, depends on the seed layer smoothness. Several parameters can be adjusted to change the morphology and, hence, the properties of the porous layer, both in the porous silicon formation and the succeeding thermal treatment. This work focuses on the effect of the parameters that control the porous silicon formation on the structure of the porous silicon layer after annealing and, more specifically, on the roughness of the top surface. The reported analysis shows how the roughness of the seed layer can be reduced to improve the quality of the epitaxial growth.
机译:在过去的几十年中,已经提出了许多制造薄(<50μm)硅太阳能电池的技术。制造薄太阳能电池的主要问题是无法获得一种可靠的方法来生产具有有限的材料损失(切缝损失)的薄硅箔,并且难以处理和加工这种易碎的箔。解决这两个问题的一种方法是在弱的烧结多孔硅层上生长外延箔。多孔硅层通过电化学蚀刻在厚的硅基板上形成,然后退火以封闭顶表面。该表面用作外延生长硅层的籽晶层,该硅层在附接到提供机械支撑的基板上时可以部分加工。之后,可以将箔纸粘合在玻璃上,拆下并在模块级别进行进一步处理。最终太阳能电池的效率将取决于外延层的质量,而外延层的质量又取决于种子层的光滑度。可以调节几个参数以改变多孔硅层的形成和随后的热处理中的多孔层的形态,从而改变其性质。这项工作着眼于控制多孔硅形成的参数对退火后多孔硅层结构的影响,尤其是对顶表面粗糙度的影响。报告的分析表明如何降低籽晶层的粗糙度以提高外延生长的质量。

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  • 会议地点 San Francisco CA(US)
  • 作者单位

    KU Leuven - Department of Electrical Engineering, Kasteelpark Arenberg 10, 3001 Leuven, Belgium,Imec, Kapeldreef 75, 3001 Leuven, Belgium;

    KU Leuven - Department of Electrical Engineering, Kasteelpark Arenberg 10, 3001 Leuven, Belgium,Imec, Kapeldreef 75, 3001 Leuven, Belgium;

    Imec, Kapeldreef 75, 3001 Leuven, Belgium;

    Imec, Kapeldreef 75, 3001 Leuven, Belgium;

    Imec, Kapeldreef 75, 3001 Leuven, Belgium;

    Imec, Kapeldreef 75, 3001 Leuven, Belgium;

    KU Leuven - Department of Electrical Engineering, Kasteelpark Arenberg 10, 3001 Leuven, Belgium,Imec, Kapeldreef 75, 3001 Leuven, Belgium;

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  • 正文语种 eng
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