晶圆预对准系统误差仿真分析

摘要

In order to systematically study the influence of each parameter on wafer pre - alignment accuracy , a wafer edge data acquisition model was established and complete collection of wafer edge data including the notch was obtained. Comparing with the calculated eccentricity and notch position of the wafer with the preset value, calculation error was achieved. According to the results under different condition , systematically studied the regulation of impact of each parameter on wafer pre - alignment accuracy and achieved important conclusions related to the control, calibration and compensation of the error.%为了系统的研究各参数对晶圆预对准精度的影响,建立了晶圆边缘数据采集模型,实现了在不同条件下包括缺口在内的晶圆边缘完整数据的采集,并在此基础上采用目前较为常见的预对准算法对晶圆的偏心及缺口位置进行计算,再将计算结果与设定的实际晶圆偏心及缺口位置进行对比,得到计算误差.通过对不同条件下仿真结果的对比,系统地研究了晶圆预对准过程中各参数对其精度的影响规律,获得了与晶圆预对准误差的控制、标定及补偿相关的重要结论.