首页> 外国专利> Wafer prealignment apparatus, its method for judging wafer presence, method for sensing wafer edge position, computer-readable record medium with recorded program for executing this position sensing method, apparatus for sensing wafer edge position, and prelignment sensor

Wafer prealignment apparatus, its method for judging wafer presence, method for sensing wafer edge position, computer-readable record medium with recorded program for executing this position sensing method, apparatus for sensing wafer edge position, and prelignment sensor

机译:晶圆预对准装置,其判断晶圆存在的方法,用于感测晶圆边缘位置的方法,具有用于执行该位置感测方法的记录程序的计算机可读记录介质,用于感测晶圆边缘位置的装置以及电量传感器

摘要

A wafer prealignment apparatus comprising a CCD linear sensor and a wafer prealignment method which facilitate the sensing of wafer presence, improvement in precision of position sensing, and edge sensing adapted to the material of the wafer even of the material is transparent or not. A photodiode (27) is provided in a vicinity of the first pixel from the center shaft of the wafer rotation means of a CCD linear sensor (5) to detect a wafer (1) on the basis of the luminous energy value. The time from the issuance of a measurement command to the sensor (5) to that of an ROG signal for transmitting the detection timing of the sensor (5) is measured to correct the angular error of a measurement position due to the rotation during this measurement. For sensing an edge position of the wafer (1), the scan start point of the sensor (5) is set on the opposite side of the center shaft of the wafer rotation means. When the wafer is transparent a sense signal is binarized to set its change point as the edge position. When the wafer is not transparent, information on a position lastly sensed as an edge is judged to be correct so that a particle may not be misrecognized as the edge.
机译:包括CCD线性传感器和晶片预对准方法的晶片预对准装置,该晶片预对准装置有利于感测晶片的存在,提高位置感测的精度,以及适合于晶片的材料(甚至是材料)的边缘感测是否透明。在距CCD线性传感器( 5 )的晶片旋转装置的中心轴较近的第一像素附近设有光电二极管( 27 ),以检测晶片( 1 )基于发光能量值。测量从发出测量命令到传感器的时间( 5 )到用于发送传感器检测时间的ROG信号的时间( 5 )进行校正测量过程中由于旋转而导致的测量位置的角度误差。为了检测晶片的边缘位置( 1 ),将传感器( 5 )的扫描起始点设置在晶片旋转中心轴的相反侧手段。当晶片是透明的时,感测信号被二值化以将其改变点设置为边缘位置。当晶片不透明时,关于最后感测为边缘的位置的信息被判断为正确的,从而不会将颗粒误识别为边缘。

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