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Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09
Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09
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1.
Unified fault management using Logic Built-In Self-Test and logic bitmap
机译:
使用Logic内置自检和逻辑位图的统一故障管理
作者:
Kay D.
;
Tran L.
;
Kamm M.
;
Orbon J.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
application specific integrated circuits;
automatic test equipment;
built-in self test;
failure analysis;
fault diagnosis;
integrated circuit testing;
logic testing;
ASIC;
BIST;
JTAG interface;
application specific integrated circuit;
fault diagnostics;
fault isolation;
logic bitmap;
logic built-in self-test;
unified fault management;
ATE;
Daignostics;
In-System;
LBIST;
Yield;
xBIST;
2.
3-D process modeling - A novel and efficient tool for MEMS foundry design support
机译:
3-D工艺建模-MEMS代工设计支持的新颖高效工具
作者:
Holzer G.
;
Knechtel R.
;
Breit S.
;
Schropfer G.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
data visualisation;
electronic design automation;
micromachining;
micromechanical devices;
virtual prototyping;
2D layout;
3D CAD techniques;
3D design check;
3D device geometry;
3D geometry;
3D process modeling;
3D virtual prototype;
MEMS SOI micromachining process;
MEMS foundry design support;
data visualization;
microfabricated devices;
semiconductor devices;
3.
Minimum power fail in high density structure improved by Chemical and Mechanical Polishing optimization
机译:
通过化学和机械抛光优化提高了高密度结构的最小停电
作者:
Denis L.
;
Dureuil V.
;
Fournier C.
;
Richou G.
;
Nogueira F.
;
Petit D.
;
Bostelmann M.
;
Comas M.
;
Dorval D.
;
Deconinck P.
;
Delahaye B.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
SRAM chips;
chemical mechanical polishing;
failure analysis;
isolation technology;
modules;
planarisation;
polishing;
CMP;
RX layout inspection;
SEM;
SRAM:;
active area-oxide ratio;
chemical polishing;
global planarization;
high density structure;
mechanical polishing;
optimization;
poly-silicon shorts;
power management unit macro;
shallow trench isolation module;
step height;
4.
Tool sensitivity analysis using neural net technique for yield improvement
机译:
使用神经网络技术进行刀具灵敏度分析以提高产量
作者:
Konkapaka P.K.
;
Pinto A.
;
Giotta P.
;
Bhattacharya S.
;
Verma G.
;
Murashov S.
;
Pathak M.
;
Menner M.
;
Smith B.G.
会议名称:
《》
|
2009年
关键词:
neural nets;
production engineering computing;
production equipment;
semiconductor device manufacture;
sensitivity analysis;
wafer level packaging;
IC manufacturing;
manufacturing equipment;
multiple iterations;
neural net technique;
nonlinear regressions;
tool sensitivity analysis;
wafer fabrication;
yield improvement;
5.
Improving electrical properties of pure nickel silicide by employing spike anneal as the second rapid thermal anneal
机译:
通过使用尖峰退火作为第二次快速热退火来改善纯硅化镍的电性能
作者:
Futase T.
;
Hashikawa N.
;
Kamino T.
;
Inaba Y.
;
Fujiwara T.
;
Suzuki T.
;
Yamamoto H.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
cleaning;
electric properties;
logic devices;
nickel compounds;
rapid thermal annealing;
semiconductor thin films;
NiSi;
chemical dry cleaning;
electrical properties;
logic device;
nickel monosilicide film;
oxygen-contamination problem;
pure nickel silicide;
rapid thermal anneal;
size 65 nm;
spike anneal;
Niinf2/infSi;
NiSiinf2/inf;
agglomeration;
nickel;
silicide;
spike annealing;
thermal stability;
6.
Application and control of Laser Anneal at the 65 and 45 nm node
机译:
激光退火在65和45 nm节点上的应用和控制
作者:
Van Roijen R.
;
Gluchenkov O.
;
Willis J.
;
Hurley M.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
laser beam annealing;
nanopatterning;
process control;
real-time systems;
semiconductor device manufacture;
laser anneal control;
patterning effect;
real-time control mechanism;
semiconductor manufacturing;
size 45 nm;
size 65 nm;
7.
Electro-static induced metal breakdown at interlayer dielectric post CMP brush clean process
机译:
静电感应金属在CMP刷清洁后的层间电介质处击穿
作者:
Lariviere S.
;
Picore F.
;
Saez P.L.
;
Baltzinger J.-L.
;
Delahaye B.
;
Matha J.
;
Gilhard X.
;
DOliveira S.
;
Lagarde J.M.
;
Prebot J.L.
;
Merlot F.
;
Nogueira F.
;
Petit D.
;
Williams S.
;
Besade E.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
chemical mechanical polishing;
electrostatic discharge;
failure analysis;
semiconductor device breakdown;
semiconductor device reliability;
surface cleaning;
TEM;
electro-static induced metal breakdown;
interlayer dielectric post CMP brush clean process;
predictive failure analysis;
process module partitioning;
8.
Advanced effective dispatching method for 300mm Twin-Phase Twin-Fab
机译:
300mm双相双晶圆厂的先进有效调度方法
作者:
Cheng-Sheng Chang
;
Hsi-Lo Lo
;
Cheng-Chung Pan
;
De-Lung Wu
会议名称:
《》
|
2009年
关键词:
production engineering;
wafer-scale integration;
advanced effective dispatching method;
advanced real-time dispatching system;
size 300 mm;
time 2.4 hr to 0.9 hr;
twin-phase twin-Fab;
300mm;
Automation;
Real-time Dispatching;
twin-Fab;
twin-phase;
9.
In-line inspection impact on Cycle Time and Yield
机译:
在线检查对周期时间和产量的影响
作者:
Tirkel I.
;
Reshef N.
;
Rabinowitz G.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
delays;
feedback;
inspection;
production engineering;
semiconductor industry;
semiconductor process modelling;
corrective feedback delay;
fixed measure rate policy;
in-line metrology inspection;
inspection policy;
objective function;
production cell model;
production lots;
production-line segment;
yield-cycle time curve;
10.
Going green with on-site generated fluorine: Sustainable cleaning agent for CVD processes
机译:
现场产生的氟使绿色环保:适用于CVD工艺的可持续清洁剂
作者:
Stockman P.
;
Shuttleworth G.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
CVD coatings;
fluorine;
surface cleaning;
CVD thin-film process chamber cleaning;
F;
GWP;
industry safety standards;
on-site generated fluorine;
sustainable cleaning agent;
total carbon footprint impacts;
11.
Edge and extreme edge wafer manufacturing on 200 mm wafer: Methodology, yield challenges, cost effective solutions, limitations
机译:
在200 mm晶圆上进行边缘和极端边缘晶圆制造:方法,产量挑战,具有成本效益的解决方案,局限性
作者:
Delahaye B.
;
Baltzinger J.L.
;
Denis L.
;
Chantepie S.
;
Costaganna P.
;
Richou G.
;
Lariviere S.
;
Aonzo F.
;
Delabriere S.
;
Poli F.
;
Bru C.
;
Meyniel J.B.
;
Allais F.
;
Dureuil V.
;
Raffin P.
;
Rondey E.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
EPROM;
chemical mechanical polishing;
etching;
integrated circuit manufacture;
lithography;
planarisation;
edge exclusion;
embedded EEPROM technology;
extreme edge wafer manufacturing;
litho processes;
planarization process;
size 0.22 mm;
size 2 mm;
size 200 mm;
spacer etch process;
12.
First Wafer Delay and setup: How to measure, define and improve First Wafer Delays and setup times in semiconductor fabs
机译:
第一晶圆延迟和建立:如何测量,定义和改善半导体晶圆厂的第一晶圆延迟和建立时间
作者:
Radloff S.
;
Abravanel M.
;
Rhoads B.
;
Steeg D.
;
van der Meulen P.
;
Petraitis M.
会议名称:
《》
|
2009年
关键词:
semiconductor process modelling;
wafer bonding;
cycle time reduction;
first wafer delay;
semiconductor fabs;
setup time;
size 450 nm;
300mm Prime;
450mm fabs;
cycle time;
13.
Design-for-manufacturing features in nanometer processes - A reverse engineering perspective
机译:
纳米工艺中的按制造设计特征-逆向工程的观点
作者:
James D.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
design for manufacture;
nanotechnology;
reverse engineering;
design-for-manufacturing;
nanometer process;
14.
Poly-width-modification method for canceling layout-dependent characteristic variations for low-standby-power CMOS technologies
机译:
用于消除低待机功率CMOS技术的用于消除与布局有关的特性变化的多边形修改方法
作者:
Nakai S.
;
Fujita K.
;
Minami T.
;
Mitani J.
;
Sawano T.
;
Chijimatsu T.
;
Deguchi T.
;
Asai S.
;
Suga M.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
CMOS integrated circuits;
MOSFET;
SPICE;
electronic engineering computing;
low-power electronics;
MOSFET-off-current estimation;
SPICE-parameter set;
STI-stress effect;
layout-dependent characteristic variations cancellation;
low-standby-power CMOS technologies;
poly-width-modification method;
well-proximity effect;
15.
Optimizing a 32nm development fab's HOL defect pareto using iDO and eADC
机译:
使用iDO和eADC优化32nm开发工厂的HOL缺陷对
作者:
Boye C.A.
;
Yathapu N.
;
Kini S.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
Pareto optimisation;
inspection;
scanning electron microscopy;
BF inspection system;
SEM;
autodefect classification;
defect baseline paretos;
electrical test;
fab HOL defect pareto;
health-of-line;
implementing smart binning;
key process sectors;
key yield limiting defects;
size 32 nm;
16.
Quantifying yield impact of polishing induced defect on the silicon surface
机译:
量化抛光引起的缺陷对硅表面的产量影响
作者:
Ohta H.
;
Byeong Sam Moon
;
Jea Gun Park
;
Sang Hyun Lee
;
Jeong Hoon An
;
Kwon Hong
;
Watanabe T.
;
Ichinose K.
;
Nemoto K.
;
Sung Ki Park
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
elemental semiconductors;
flaw detection;
inspection;
polishing;
scanning electron microscopy;
silicon;
SEM tools;
Si;
gate-dielectric defects;
polishing induced defect;
wafer-surface inspection;
yield impact;
AFM;
Defect Inspection;
Defect Review;
EDS;
Laser;
PID;
SEM;
Scattering;
Silicon Wafer;
Simulation;
TEM;
Yield;
17.
2009 ASMC organizing committee
机译:
2009 ASMC组委会
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
18.
An iterative outlier screening procedure for reliability data using mixed effect modeling
机译:
使用混合效应建模的可靠性数据的迭代离群值筛选程序
作者:
Jayanarayanan S.K.
;
Hu H.
;
McGaughey K.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
iterative methods;
regression analysis;
reliability;
semiconductor device models;
NBTI;
data-points;
individual stress conditions;
iterative outlier screening procedure;
mixed effect modeling;
negative bias temperature instability;
regression line;
reliability data;
19.
Reduction of defects caused by chemical mechanical polishing of oxide surfaces and contamination of the wafer bevel
机译:
减少由于对氧化物表面进行化学机械抛光和晶圆斜面污染而导致的缺陷
作者:
Gallus S.M.
;
Niedermeier F.
;
Maue M.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
chemical mechanical polishing;
semiconductor devices;
surface contamination;
BEOL;
CMP process slurry ingredients;
abrasive particles;
additives;
continuous defect reduction project;
microscratches;
oxide CMP processes;
oxide surfaces;
planarization technique;
polishing pad;
slurry particles;
surface contaminations;
wafer bevel;
CMP;
continuous improvement;
defect density reduction;
20.
Yield enhancement and excursions prevention using fault detection and classification methods and product test data
机译:
使用故障检测和分类方法以及产品测试数据来提高产量和防止偏移
作者:
Ansquer H.
;
Balsan C.
;
Moreaud N.
;
Deprost D.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
fault diagnosis;
semiconductor device manufacture;
semiconductor device testing;
fault classification;
fault detection;
product test data;
product yield enhancement;
wafer edge;
wafer probe yield;
21.
Detection of critical defects with E-beam technology for development and monitoring of advanced NAND processes
机译:
使用电子束技术检测关键缺陷,以开发和监视高级NAND工艺
作者:
Hayashi H.
;
Oomura M.
;
Ihata N.
;
Shinkawa A.
;
Fan F.
;
Jufeng Li
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
NAND circuits;
electron beam testing;
flash memories;
inspection;
process monitoring;
transmission electron microscopy;
DOI detection;
NAND flash device;
NAND flash memory manufacturing;
TEM analysis;
V1WCMP wafer;
advanced NAND processes;
critical defects detection;
critical yield-limiting defects;
defect of interest;
e-beam technology;
electron beam inspection;
inspection parameters;
production monitoring;
signal to noise analysis;
under-etch;
E-Beam inspection (EBI);
NAND processes;
S/N analysis;
voltage contrast (V;
22.
Prediction of chemical consumption in semiconductor fabrication
机译:
预测半导体制造中的化学消耗
作者:
Zisgen H.
;
Kleinhenz R.
;
Eickelmann H.-J.
;
Haubrich M.
;
Marschollek F.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
bills of materials;
queueing theory;
semiconductor industry;
semiconductor process modelling;
Chemical BOM;
Enterprise Production Planning and Optimization;
chemical consumption;
product mix analysis;
queueing network model;
semiconductor fabrication;
workload dependency analysis;
23.
Virtual metrology for plasma etch using tool variables
机译:
使用工具变量进行等离子蚀刻的虚拟计量
作者:
Lynn S.
;
Ringwood J.
;
Ragnoli E.
;
McLoone S.
;
MacGearailty N.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
plasma materials processing;
sputter etching;
RF measurement;
etch tool parameters;
industrial plasma etch process;
piecewise modelling effort;
power measurement;
pressure measurement;
temperature measurement;
virtual metrology;
wafer etch rate;
wafer processing time;
24.
A new surface analysis method for semiconductor manufacturing, based on surface-potential measurements
机译:
基于表面电势测量的半导体制造的新表面分析方法
作者:
Schuetten R.
;
Kleber M.
;
Jerenz M.
;
Gregorius I.
;
Zimmermann B.
;
Kaesmaier R.
;
Hickson J.
;
Tamayo N.
;
Newcomb R.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
semiconductor technology;
surface contamination;
surface potential;
nonvisible residues;
optical wafer inspection system;
semiconductor contamination;
semiconductor manufacturing;
surface analysis method;
surface potential measurement;
thermal budget;
thin monolayer contamination;
25.
Superior etch performance of Ar/N
2
/F
2
for PECVD chamber clean
机译:
用于PECVD腔室清洁的Ar / N
2 inf> / F
2 inf>优异的蚀刻性能
作者:
Riva M.
;
Pittroff M.
;
Schwarze T.
;
Wieland R.
;
Oshinowo J.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
argon;
cleaning;
etching;
fluorine;
gas mixtures;
nitrogen;
plasma CVD;
silicon;
Ar-Nsub2/sub-Fsub2/sub;
Ar-Nsub2/sub-Fsub2/sub gas mixture;
PECVD chamber clean;
amorphous silicon;
drop-in replacement;
gas consumption;
inert gases;
stainless steel gas cylinders;
26.
Application of a Run-to-Run controller to a vapor phase epitaxy process
机译:
Run-to-Run控制器在气相外延过程中的应用
作者:
De Luca C.
;
Maran E.
;
Baumgartl J.
;
Beghi A.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
Kalman filters;
doping profiles;
elemental semiconductors;
feedback;
process control;
semiconductor doping;
semiconductor epitaxial layers;
silicon;
vapour phase epitaxial growth;
Kalman filter;
Si;
a posteriori check filters;
a priori check filters;
deposition time;
dopant concentration;
dopant flow;
feedback control;
run-to-run controller;
semiconductor;
vapor phase epitaxy;
27.
Novel in-line inspection method for non-visual defects and charging
机译:
新型的非视觉缺陷在线检查方法和收费
作者:
Hoppner K.
;
Manuwald R.
;
Fahr T.
;
Zschech E.
;
Tamayo N.
;
Hickson J.
;
Adrian B.
;
Newcomb R.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
CMOS integrated circuits;
inspection;
integrated circuit measurement;
semiconductor industry;
transistors;
in-line inspection method;
next-generation CMOS technology;
nonvisual defect;
surface potential difference measurement;
ultra thin transistor;
28.
Reducing contamination by particles reflected in turbo molecular pump
机译:
减少涡轮分子泵中反射颗粒的污染
作者:
Kobayashi H.
;
Maeda K.
;
Izawa M.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
discharges (electric);
etching;
machine components;
photoresists;
plasma boundary layers;
plasma sheaths;
vacuum pumps;
carrier gas;
down-flow particle control;
particle contamination;
particle trajectory;
photoresist;
plasma discharge;
plasma-sheath boundary;
scattered particles;
turbo molecular pump;
wafer transfer;
29.
Defect reduction in ArF immersion lithography, using particle trap wafers with CVD thin films
机译:
使用带有CVD薄膜的颗粒捕获晶片,可减少ArF浸没式光刻的缺陷
作者:
Matsui Y.
;
Onoda N.
;
Nagahara S.
;
Uchiyama T.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
CVD coatings;
argon compounds;
free energy;
immersion lithography;
silicon compounds;
surface energy;
ArF;
CVD thin films;
CVD wafer;
SiCN;
defect reduction;
immersion water;
interfacial free energy;
particle trap wafers;
trapping particle potential;
30.
Novel SEM based imaging using secondary electron spectrometer for enhanced voltage contrast and bottom layer defect review
机译:
使用二次电子光谱仪的基于SEM的新型成像技术,可增强电压对比度并检查底层缺陷
作者:
Avinun-Kalish M.
;
Sagy O.
;
Seong Moon Im
;
ChangHwan Lee
;
Jaehyoung Oh
;
Jungyeon Lim
;
Chulhong Kim
;
Hyungwon Yoo
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
flaw detection;
scanning electron microscopy;
secondary electron emission;
aspect ratio;
bottom layer;
defects;
dense topographies;
enhanced voltage contrast;
high quality SEM imaging;
image quality;
secondary electron spectrometer;
31.
Novel method to generate inspection care areas using GDS
机译:
使用GDS生成检查护理区域的新方法
作者:
HoSung Kang
;
MinHo Kim
;
KiHo Kim
;
SooCheol Lee
;
Jung-A Choi
;
YeonHo Pae
;
ChangHo Lee
;
Lee C.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
inspection;
microassembling;
inspection care areas;
mass production;
wafer inspection;
32.
Focus and CD control by scatterometry measurements for 65/45nm node devices
机译:
通过散射测量对65 / 45nm节点设备进行聚焦和CD控制
作者:
Kawachi T.
;
Fudo H.
;
Yamashita S.
;
Yamamoto K.
;
Narimatsu K.
;
Matsumoto S.
;
Miwa T.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
photoresists;
process control;
semiconductor device measurement;
shape control;
spatial variables measurement;
CD simultaneous control method;
critical dimension variation reduction effect;
focus optimization;
lithography process;
photo resist shape control;
production control;
response surface method model;
scatterometry measurement;
size 45 nm;
size 65 nm;
33.
Optical spectral emission endpoint detection for passivation etch
机译:
用于钝化蚀刻的光谱发射终点检测
作者:
Yue Kok Hong Kenneth
;
Chin Chye Seng
;
Chin Tiong Tay
;
Se Kwang Leong James
;
Boon Kiat Goh
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
34.
Predicting the mean cycle time as a function of throughput and product mix for cluster tool workstations using EPT-based aggregate modeling
机译:
使用基于EPT的聚合模型预测群集工具工作站的平均周期时间与产量和产品组合的关系
作者:
Veeger C.P.L.
;
Etman L.F.P.
;
van Herk J.
;
Rooda J.E.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
production engineering computing;
production planning;
queueing theory;
semiconductor device manufacture;
workstation clusters;
Crolles2 cluster tool workstation;
aggregate modeling;
cluster tool workstations;
effective process time;
lumped-parameter representation;
mean cycle time prediction;
queueing system;
workstation operational product mix;
CT-TH-PM surfaces;
cycle time;
factory dynamics;
manufacturing performance;
simulation;
35.
Manufacturing optimization improvements leveraging SEMI E94-1107
机译:
利用SEMI E94-1107改进制造优化
作者:
Maxim C.
;
Goss R.
;
Rothe J.
;
Drozda M.
;
Adhikari D.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
integrated circuit yield;
just-in-time;
monolithic integrated circuits;
semiconductor device manufacture;
semiconductor industry;
standards;
SEMI E94-1107 standard;
cycle time;
fab performance indicators;
just-in-time customer response;
manufacturing optimization improvements;
throughput;
wafer processing;
yield;
36.
Managing the challenges of multi-product manufacturing
机译:
应对多产品制造的挑战
作者:
Weber C.M.
;
Fayed A.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
integrated circuit manufacture;
fabrication cycle time;
multiproduct manufacturing;
wafers;
Scale;
cycle time;
multi-product;
scope;
37.
Technology-enabled employee wellness: Emerging trends, applications, and results
机译:
技术推动的员工健康:新兴趋势,应用程序和结果
作者:
Lantz S.
;
Severson T.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
employee welfare;
occupational health;
occupational safety;
competitive advantage;
employee wellness programs;
employer;
technology-enabled employee wellness;
38.
Supervised learning methods in sort yield modeling
机译:
排序产量建模中的监督学习方法
作者:
Helen Hu
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
electronic engineering computing;
learning (artificial intelligence);
monolithic integrated circuits;
regression analysis;
trees (mathematics);
classification and regression tree technique;
data relationships;
electrical parameters;
machine learning techniques;
multinomial logistic regression;
process equipment;
random forest method;
semiconductor data;
sort yield modeling;
supervised learning methods;
yield prediction models;
39.
Optimizing flexibility and equipment utilization through qualification management
机译:
通过资格管理优化灵活性和设备利用率
作者:
Johnzen C.
;
Dauzere-Peres S.
;
Vialletelle P.
;
Yugma C.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
decision support systems;
optimisation;
production engineering;
production engineering computing;
production equipment;
quality management;
semiconductor industry;
tools;
decision support system;
equipment utilization;
flexibility;
optimization;
qualification management;
semiconductor manufacturing equipment;
Flexibility Optimization;
Industrial Engineering;
Manufacturing Efficiency;
WIP Management;
40.
Interconnection failure caused by bath degradation in copper electroplating and its VM-FDC using mathematical model
机译:
数学模型中电镀液浴性能下降引起的互连故障及其VM-FDC
作者:
Imai S.-I.
;
Kitabata M.
;
Tanaka T.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
electroplating;
failure analysis;
mathematical analysis;
VM-FDC;
copper electroplating;
high performance liquid-chromatograph;
interconnection failure;
mathematical model;
plating bath degradation;
41.
Novel single-wafer, single-chamber combined dry and wet system for stripping and in-situ cleaning of high-dose ion-implanted photoresists
机译:
新型单晶圆,单腔组合干湿系统,用于高剂量离子注入光刻胶的剥离和原位清洗
作者:
Kim Y.J.
;
Yoon C.R.
;
Roh E.S.
;
Cho J.K.
;
Hattori T.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
cleaning;
photoresists;
plasma immersion ion implantation;
advanced semiconductor manufacturing;
atmospheric pressure plasma unit;
dry ashing;
high-dose ion-implanted photoresists;
in-situ cleaning;
moderate-temperature wet cleaning;
single-wafer single-chamber combined dry and wet system;
single-wafer spin-cleaning system;
stripping;
42.
40 cycle time improvement as a result of continuous improvement activities
机译:
持续改进活动使周期时间缩短了40%
作者:
Janke B.
;
Kuschereitz U.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
product development;
semiconductor device manufacture;
semiconductor device reliability;
Qimonda Frontend Wafer-FAB;
chip delivery;
continuous improvement activities;
semiconductor frontend manufacturing;
waste reduction;
43.
Etch adjustment for independent CD control in Double Patterning
机译:
蚀刻调整,用于双图案中的独立CD控制
作者:
Barnola S.
;
Lapeyre C.
;
Servin I.
;
McCallum M.
;
Magoon H.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
etching;
lithography;
nanopatterning;
semiconductor device manufacture;
double patterning;
etch adjustment;
independent CD control;
litho1-etch1-litho2-etch2;
size 32 nm;
size 45 nm;
44.
About
机译:
关于
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
45.
Identifying key process characteristics and predicting etch rate from high-dimension datasets
机译:
从高维数据集中识别关键工艺特征并预测蚀刻速率
作者:
Ragnoli E.
;
McLoone S.
;
Lynn S.
;
Ringwood J.
;
Macgearailt N.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
etching;
integrated circuit manufacture;
process control;
process monitoring;
semiconductor technology;
etch rate;
high dimension datasets;
semiconductor manufacturing advanced process control;
46.
Low-k wafer scribing using water jet-guided laser technology with 10 ns lasers
机译:
使用10 ns激光器的水射流引导激光技术进行低k晶圆划片
作者:
Pauchard A.
;
Obi S.
;
Lee K.
;
Richerzhagen B.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
laser beam cutting;
permittivity;
semiconductor technology;
water jet cutting;
low-k wafer scribing;
short pulse lasers;
water jet-guided laser technology;
47.
Role of new materials in enhancing productivity of semiconductor manufacturing equipment
机译:
新材料在提高半导体制造设备生产率中的作用
作者:
Foggiato J.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
elastomers;
production equipment;
productivity;
semiconductor device manufacture;
manufacturing productivity;
seals;
semiconductor manufacturing equipment;
48.
SACVD clean investigation with a new calorimetric probe sensor
机译:
使用新的量热探针传感器进行SACVD清洁调查
作者:
Kunstmann T.
;
Paulus S.
;
Ing-Shin Chen
;
Auer H.
;
Lin Feng
;
Chism R.
;
Roeder J.F.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
calorimetry;
plasma CVD;
plasma sources;
probes;
sensors;
surface cleaning;
calorimetric probe sensor;
clean time optimization;
endpoint curves;
numerical model;
preventive maintenance;
remote plasma source;
standalone software utility;
subatmospheric CVD;
49.
Contamination induced risk reduction through improved control plan implementation
机译:
通过改进控制计划的实施,减少污染引起的风险
作者:
Maillot P.
;
Le Gall M.
;
Pic N.
;
Martin C.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
contamination;
control engineering computing;
health and safety;
process monitoring;
semiconductor industry;
statistical process control;
RD;
metallic contamination;
monitoring;
optimized control plan;
process control;
production;
risk reduction;
50.
Virtual Metrology models for predicting physical measurement in semiconductor manufacturing
机译:
虚拟计量模型可预测半导体制造中的物理测量
作者:
Ferreira A.
;
Roussy A.
;
Conde L.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
integrated circuit manufacture;
semiconductor device manufacture;
individual process applications;
industrial data;
large-volume multistage manufacturing system;
physical measurement prediction;
semiconductor manufacturing industry;
virtual metrology models;
wafer monitoring;
wafer state information;
51.
Increasing yields with in-tool ionization
机译:
仪器内电离提高产量
作者:
Steinman A.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
electrostatics;
ionisation;
semiconductor device manufacture;
semiconductor devices;
charge neutralization;
feature dimensions;
in-tool ionization;
particles per wafer pass;
process yield;
static charge;
52.
Fully automated multi sensor metrology for frontend use in MEMS and semiconductor
机译:
全自动多传感器计量技术,用于MEMS和半导体的前端
作者:
Fries T.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
micromechanical devices;
optical sensors;
printed circuits;
sensor fusion;
surface topography measurement;
MEMS;
PCB;
device surfaces;
microelectronics industry;
multisensor metrology;
profile measurements;
resolution topography;
roughness measurements;
semiconductor industry;
surface metrology tools;
53.
Impact of intra-die thermal variation on accurate MOSFET gate-length measurement
机译:
芯片内热变化对精确MOSFET栅极长度测量的影响
作者:
Ahsan I.
;
Schroder D.K.
;
Nowak E.
;
Gluschenkov O.
;
Zamdmer N.
;
Logan R.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
MOSFET;
rapid thermal annealing;
semiconductor device measurement;
thermal analysis;
MOSFET gate-length measurement;
capacitive technique;
electrical measurement;
intradie thermal variation;
local pattern density;
long-wide plate gate capacitor;
long-wide poly-silicon resistor;
rapid thermal anneal condition;
54.
Tracking of design related defects hidden in the random defectivity in a production environment
机译:
跟踪生产环境中随机缺陷中隐藏的与设计相关的缺陷
作者:
Le Denmat J.C.
;
Charbois V.
;
Luche M.C.
;
Kerrien G.
;
Couturier L.
;
Karsenti L.
;
Geshel M.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
flaw detection;
integrated circuit manufacture;
pattern matching;
production engineering computing;
automatic flow;
design based binning tool;
inspection defect files;
production environment;
random defectivity;
statistical correlation;
systematic defects;
Design based binning;
systematic defectivity;
55.
Towards identification of latent defects: Yield mining using defect characteristic model and clustering
机译:
识别潜在缺陷:使用缺陷特征模型和聚类进行产量挖掘
作者:
Ooi M.P.-L.
;
Chan C.
;
Lee S.-L.
;
Mohanan A.A.
;
Goh L.Y.
;
Kuang Y.C.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
data mining;
flaw detection;
integrated circuit manufacture;
integrated circuit modelling;
statistical analysis;
defect characteristic model;
defect clusters;
dies;
integrated circuit manufacturing;
latent defect;
statistical yield modeling;
yield mining;
defect cluster;
yield model;
56.
TLS-Dicing - An innovative alternative to known technologies
机译:
TLS切片-替代已知技术的创新方法
作者:
Zuhlke H.-U.
;
Eberhardt G.
;
Ullmann R.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
brittleness;
cooling;
laser materials processing;
semiconductor technology;
TLS-Dicing;
brittle materials;
cleaving;
thermal induced mechanical forces;
thermal-laser-separation;
water-spray cooling;
57.
Development of a TiN-CVD process with very high step coverage
机译:
开发具有很高台阶覆盖率的TiN-CVD工艺
作者:
Ruhl G.
;
Krenzer M.
;
Batke J.-M.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
CVD coatings;
chemical vapour deposition;
electrical resistivity;
plasma materials processing;
titanium compounds;
CVD;
TiN;
conducting barrier;
electrode films;
high-aspect ratio devices;
plasma treatment;
step coverage;
thermal deposition;
58.
Advances on yield learning through concurrent evaluation of design and process data
机译:
通过同时评估设计和过程数据来提高良率学习的进展
作者:
Appello D.
;
Tancorre V.
;
Suzor C.
;
Hall M.
;
Talluto S.
;
Kekare S.A.
会议名称:
《Advanced Semiconductor Manufacturing Conference, 2009. ASMC '09》
|
2009年
关键词:
integrated circuit testing;
integrated circuit yield;
design concurrent evaluation;
electrical test;
process data concurrent evaluation;
wafers functional test;
yield learning;
yield losses;
ATPG;
hot spots;
scan chain;
systematic failures;
volume diagnostics;
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