首页> 外国专利> WAFER PREALIGNMENT APPARATUS, ITS METHOD FOR JUDGING WAFER PRESENCE, METHOD FOR SENSING WAFER EDGE POSITION, COMPUTER-READABLE RECORD MEDIUM WITH RECORDED PROGRAM FOR EXECUTING THIS POSITION SENSING METHOD, APPARATUS FOR SENSING WAFER EDGE POSITION, AND PREALIGNMENT SENSOR

WAFER PREALIGNMENT APPARATUS, ITS METHOD FOR JUDGING WAFER PRESENCE, METHOD FOR SENSING WAFER EDGE POSITION, COMPUTER-READABLE RECORD MEDIUM WITH RECORDED PROGRAM FOR EXECUTING THIS POSITION SENSING METHOD, APPARATUS FOR SENSING WAFER EDGE POSITION, AND PREALIGNMENT SENSOR

机译:晶片预对准装置,晶片存在判断方法,晶片边缘位置传感方法,具有执行该位置传感方法的记录程序的计算机可读记录介质,晶片边缘位置传感装置以及预校正传感器

摘要

A wafer prealignment apparatus comprising a CCD linear sensor and a wafer prealignment method which facilitate the sensing of wafer presence, improvement in precision of position sensing, and edge sensing adapted to the material of the wafer even though the material is transparent or not. A photodiode (27) is provided in a vicinity of the first pixel from the center shaft of the wafer rotation means of a CCD linear sensor (5) to detect a wafer (1) on the basis of the luminous energy value. The time from the issuance of a measurement command to the sensor (5) to that of an ROG signal for transmitting the detection timing of the sensor (5) is measured to correct the angular error of a measurement position due to the rotation during this measurement. For sensing an edge position of the wafer (1), the scan start point of the sensor (5) is set on the opposite side of the center shaft of the wafer rotation means. When the wafer is transparent, a sense signal is binarized to set its change point as the edge position. When the wafer is not transparent, information on a position lastly sensed as an edge is judged to be correct so that a particle may not be misrecognized as the edge.
机译:晶片预对准装置,其包括CCD线性传感器和晶片预对准方法,即使材料是透明的或非透明的,其也适合于晶片的材料,所述晶片预对准方法有助于晶片的存在的感测,位置感测的精度的改进以及边缘感测。光电二极管(27)设置在距CCD线性传感器(5)的晶片旋转装置的中心轴的第一像素附近,以基于发光能量值检测晶片(1)。测量从向传感器(5)发出测量命令到用于发送传感器(5)的检测定时的ROG信号的时间,以校正由于该测量期间的旋转引起的测量位置的角度误差。 。为了检测晶片(1)的边缘位置,将传感器(5)的扫描起点设置在晶片旋转装置的中心轴的相反侧。当晶片是透明的时,将检测信号二值化以将其改变点设置为边缘位置。当晶片不透明时,关于最后感测为边缘的位置的信息被判断为正确的,从而不会将颗粒误识别为边缘。

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