半导体器件键合失效模式及机理分析

摘要

This paper analyzed the effect of non-proper wire bonding process and packaging process on wire bonding failure by typical FA cases.Through detailed analysis of influential factors of wire bonding process parameter and environmental factors of packaging,and the summary of failure mode of wire bonding,the intrinsic failure mechanism of wire bonding caused by non-proper wire bonding process and packaging process is posed,and the using measures to control devices with defects are proposed,too.%本文通过对典型案例的介绍,分析了键合工艺不当,以及器件封装因素对器件键合失效造成的影响.通过对键合工艺参数以及封装环境因素影响的分析,以及对各种失效模式总结,阐述了键合工艺不当及封装不良,造成键合本质失效的机理;并提出了控制有缺陷器件装机使用的措施.