DEFECT DETECTOR, DEFECT DETECTION METHOD, WAFER, SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, DIE BONDER, BONDING METHOD, SEMICONDUCTOR MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a defect detector and a defect detection method, capable of stably detecting the presence or absence of defects such as cracks, and also to provide a die bonder and a bonding method.SOLUTION: Defects are detected which are formed in a coating layer in a work piece equipped with a variable density layer having a variable density pattern, and a coating layer covering the variable density pattern of the variable density layer. Illumination light irradiated from an illuminator has a wavelength whose strength of light made incident on an imaging device by being reflected or scattered from the coating layer is larger than that of the light made incident on the imaging device by being reflected from at least the variable density layer. For this reason, this illumination light reduces influence on the variable density pattern of the variable density layer.SELECTED DRAWING: Figure 1