Interactive Effects of Bond Wires Used for Microwave Semiconductor Device Combining and Matching Circuitry

摘要

For arrays of bond wires, inter-wire coupling can significantly affect the parameters of the individual wires. Design information is given for two port problems consisting of multiple bond wire arrays over a ground plane. Secondly, bond wire coupling can degrade the combining efficiency of several wire-combined solid state devices (such as transistor unit cells). This problem is modeled and analyzed, and remedies are suggested. (Author)