Bonding wire protecting device, has bonding sites provided on circuitry carrier e.g. circuit board, and plug connector, where bend protection units are provided on regions of bonding wire

摘要

The device has bonding sites provided on a circuitry carrier (20) e.g. circuit board, and a plug connector (22). Bend protection units e.g. medium-soft or medium-hard silicone cappings, are provided on regions of a bonding wire (16). The silicone cappings are provided with hardness of 20-80 shore and vulcanized by UV-radiation. The silicone cappings comprise an elastic module region that lies between 0.5 to 10 Newton per square millimeter. The circuitry carrier is arranged in a sensor housing (12).