Method for electrically connecting e.g. capacitor with ceramic circuit carrier, involves providing surface mounted device component with surfaces, and connecting component terminals with strip conductors of circuit carrier by bonding wires

摘要

The method involves providing a surface mounted device (SMD) component (1) with surfaces (3, 4), where one of the surfaces is provided with solderable, electrically conductive component terminals (2). The other surface of the component is connected with space in a circuit carrier (5) by an adhesive (7) i.e. thermally conductive adhesive. The component terminals are connected with strip conductors (6) of the circuit carrier by bonding wires (10). Solder contacts and bond contacts are made of gold.