ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for semiconductor bonding, which achieves both storage stability and quick curability to suppress voids and is excellent in physical properties of cured products, and to provide an adhesive film for semiconductor bonding using the adhesive for semiconductor bonding, a method for manufacturing a semiconductor device, and a semiconductor device.SOLUTION: The adhesive for semiconductor bonding contains: an epoxy (meth)acrylate compound containing one or more (meth)acryl groups and epoxy groups in one molecule respectively; an epoxy curing agent; and an organic peroxide.