倒装芯片互连结构中电流聚集研究

摘要

Electro-migration becomes a critical reliability issue for high density solder joints in flip chip technology, especially for current crowding. Electro-migration force and mean time to failure of flip chip were analyzed. This study employed two-dimensional simulation to investigate the distribution of current density and Joule heat in the flip chip joint. And the factors that impact the distribution of current density and Joule heat were studied. The results show that the thicknesses of Al and UBM have great influences on the distribution of current density and Joule heat.%由于电流聚集，在倒装芯片封装技术中，电迁移已经成为一个关键的可靠性问题。分析了电迁移力和电迁移中值失效时间，采用二维模型研究了电流密度和焦耳热在倒装芯片互连结构中的分布以及影响电流密度和焦耳热分布的因素。结果表明铝线(Al)和凸点下金属层(UBM)的厚度对电流密度和焦耳热分布有很大的影响。