首页> 中文期刊> 《电子元件与材料》 >低温共烧Na2O-B2O3-SiO2玻璃/Al2O3复合材料烧结工艺的研究

低温共烧Na2O-B2O3-SiO2玻璃/Al2O3复合材料烧结工艺的研究

         

摘要

采用烧结法制备了低温共烧Na2O-B2O3-SiO2玻璃/Al2O3复合材料。研究了玻璃粉末的粒度、玻璃与Al2O3质量比,成型压力和热处理制度对复合材料烧结性能和电学性能的影响。结果表明,玻璃粉末中位径为1.233μm、玻璃/Al2O3质量比为3:7、成型压力为15 MPa、烧结温度为900℃以及保温时间为2 h时,复合材料具有较高的体积电阻率(3.8×1012Ω·cm)、较低的介电常数(6.86)和介电损耗(0.00143),可以满足基板材料对电学性能的要求。%Low temperature co-fired Na2O-B2O3-SiO2/Al2O3 composites were prepared by sintering method. The effect of the particle size of glass powder, mass ratio of glass to Al2O3, molding pressure and heating treatment on the sintering and electrical performance were investigated. The results show that when the particle size of the glass is 1.233μm, the mass ratio of glass to Al2O3 is 3:7, molding pressure is 15 MPa, sintering temperature is 900℃, and the holding time is 2 h, the apparent porosity is 0.55%. In addition, the composite material has high volume resistivity of 3.8×1012Ω·cm, low dielectric constant of 6.86 and low dielectric loss of 0.001 43, which can meet the requirements of the electrical properties of the substrate materials.

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