MEMS高g加速度传感器封装贴片技术的研究

摘要

针对设计的高g加速度传感器,建立封装有限元模型,并利用ANSYS软件仿真分析了贴片热应力及贴片技术对高g加速度传感器性能的影响.分析结果表明,贴片胶的热膨胀系数、弹性模量和厚度是影响热应力的主要因素,同时贴片胶的弹性模量、厚度及贴片胶的量将影响到传感嚣的输出灵敏度.%The finite element model for the encapsulation of high-g acceleration sensors was established, and the SMT( surface mounting technology) thermal stress effect on high-g acceleration sensor performance was simulated with ANSYS. The simulation results show that the thermal expansion coefficient, elastic modulus and thickness of SMT adhesive mainly influence the thermal stress distribution and the output sensitivity of sensors.