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Epitaxial Growth of 3C-SiC on T-shape columnar Si Substrates

机译:T形柱状硅衬底上3C-SiC的外延生长

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摘要

Cubic silicon carbide (3C-SiC) is a suitable semiconductor material for high temperature, high power and high frequency electronic devices, because of its wide bandgap, high electron mobility and high saturated electron drift velocity. The usage of Si substrates has the advantage of large area substrates for the growth of 3C-SiC layers. However, large lattice mismatch between 3C-SiC and Si ( > 20%) has caused the generation of defects such as misfit dislocations, twins, stacking faults and threading dislocations at the SiC/Si interface. Lateral epitaxial overgrowth (ELOG) of 3C-SiC on Si substrates using SiO2 has been reported to reduce the defect density. In this report, epitaxial growth of 3C-SiC on T-shape patterned (100) Si substrates has been investigated to reduce interfacial defects.
机译:立方碳化硅(3C-SiC)由于其带隙宽,高电子迁移率和高饱和电子漂移速度而成为适用于高温,高功率和高频电子设备的半导体材料。 Si衬底的使用具有用于3C-SiC层生长的大面积衬底的优点。然而,3C-SiC与Si之间的晶格失配较大(> 20%)已导致产生缺陷,例如失配位错,孪晶,堆叠缺陷和SiC / Si界面处的螺纹位错。据报道,在使用SiO2的Si衬底上3C-SiC的横向外延过度生长(ELOG)可以降低缺陷密度。在此报告中,已经研究了在T形图案化(100)Si衬底上外延生长3C-SiC的方法,以减少界面缺陷。

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