In this paper, solder joint fatigue life is examined by experimental evaluation and finite element analysis. We evaluate the ceramic BGA package solder joint reliability under thermal stresses. To eonfirm the validity of FEM analysis, we compare the initial cracking position caused by thermal stress to the maximum nonlinear strain position determined by the FEM analysis Alos, we compare the experimental warpage of package and substrate caused by the temperature change to the calculated warpage. The FEM results agree well with the experimental ones. The FEM analysis is effective for the evaluation of the package design.
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