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Applying ILT mask synthesis for co-optimizing design rules and DSA process characteristics

机译:应用ILT掩模合成来共同优化设计规则和DSA工艺特性

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摘要

During early stage development of a DSA process, there are many unknown interactions between design, DSA process, RET, and mask synthesis. The computational resolution of these unknowns can guide development towards a common process space whereby manufacturing success can be evaluated. This paper will demonstrate the use of existing Inverse Lithography Technology (ILT) to co-optimize the multitude of parameters. ILT mask synthesis will be applied to a varied hole design space in combination with a range of DSA model parameters under different illumination and RET conditions. The design will range from 40 nm pitch doublet to random DSA designs with larger pitches, while various effective DSA characteristics of shrink bias and corner smoothing will be assumed for the DSA model during optimization. The co-optimization of these design parameters & process characteristics under different SMO solutions and RET conditions (dark/bright field tones and binary/PSM mask types) will also help to provide a complete process mapping of possible manufacturing options. The lithographic performances for masks within the optimized parameter space will be generated to show a common process space with the highest possibility for success.
机译:在DSA流程的早期开发过程中,设计,DSA流程,RET和掩模合成之间存在许多未知的相互作用。这些未知数的计算分辨率可以指导开发朝着通用的过程空间发展,从而可以评估制造成功。本文将演示如何使用现有的反光刻技术(ILT)来共同优化多个参数。 ILT掩模合成将结合不同的照明和RET条件下的一系列DSA模型参数应用于变化的孔设计空间。该设计的范围从40 nm的双倍间距到具有更大间距的随机DSA设计,而在优化过程中将为DSA模型假设各种有效的DSA特性(收缩偏差和拐角平滑)。在不同的SMO解决方案和RET条件(暗/明场音调和二进制/ PSM掩模类型)下,这些设计参数和工艺特性的共同优化也将有助于提供可能制造方案的完整工艺图。将生成优化参数空间内的掩模的光刻性能,以显示具有最大成功可能性的通用工艺空间。

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