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Dramatic Improvement of Ge p-MOSFET Characteristics Realized by Amorphous Zr-Silicate/Ge Gate Stack with Excellent Structural Stability through Process Temperatures

机译:通过工艺温度具有优异的结构稳定性,通过工艺稳定性实现GE P-MOSFET特性的巨大改善

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Ge diffusion into high-k layer is completely suppressed by taking advantage of thermally stable Zr-silicate/Ge structure. This leads to high μ{sub}(h) of 210 cm{sup}2/Vsec at 0.1M V/cm, which is two times higher than that of ZrO{sub}2/Ge and even 23% higher than the value for Si universal curve. EOT scalability of Zr-silicate/Ge gate stacks is comparable to that of ZrO{sub}2/Ge one.
机译:通过利用热稳定的ZR-硅酸盐/ GE结构,完全抑制了Ge扩散到高k层。这导致高μ{sub}(h)为210cm {sup} 2 / vsec,0.1mV / cm,其比Zro {sub} 2 / Ge高的两倍,甚至比值高23% SI通用曲线。 Zr-硅酸盐/ GE门堆的EOT可扩展性与ZrO {Sub} 2 / GE One的EOT可扩展性相当。

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