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A very low temperature (170 °C) crystallization of amorphous-Ge thin film on glass via Au induced layer exchange process in amorphous-Ge/GeOx/ Au/glass stack and electrical characterization

机译:通过Au诱导层交换过程在玻璃上的玻璃上的非常低的温度(170℃)结晶,AU诱导层面交换过程中的Au / Geox / Au /玻璃堆和电学特性

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We report the realization of polycrystalline (poly)-Ge thin film on glass (insulator) at a significantly low temperature of similar to 170 degrees C. We realized it using Au induced layer exchange crystallization scheme in a thin film stack having amorphous (a)-Ge/GeOx /Au/glass structure. The observed crystallization temperature is one of the lowest values reported in the literature. The paper also discusses the interface energetics that drives the crystallization in detail. Au has an extremely low solubility of similar to 1.3 x 10(7) cm(-3) in Ge at this low processing temperature. The layer exchange process facilitates an effective etching of the Au layer, resulting in a poly-Ge thin film free of contamination from residual Au impurities within EDS's sensitivity. However, the poly-Ge thin film exhibits a p-type semiconducting behavior, with a moderate doping concentration of similar to 1.3 x 10(17) cm(-3) , and a low resistivity similar to 1 Omega cm at RT due to point defects induced acceptor states. The thin film showed a mobility similar to 50 cm(2) V-1 -s(-1) at RT, highest for a poly-Ge thin film formed at such low temperature. The temperature dependence of mobility indicates a high barrier of similar to 84 meV at the grain boundaries, which serve as the main scattering mechanism limiting the carrier conduction.
机译:我们报告了在玻璃(绝缘体)上的多晶(多晶硅)薄膜的实现,其在类似于170℃的明显低温下。我们在具有无定形(A)的薄膜堆叠中使用Au诱导的层交换结晶方案实现了它-ge / geox / au /玻璃结构。观察到的结晶温度是文献中报道的最低值之一。本文还讨论了详细推动结晶的界面能量。在该低加工温度下,Au在GE中具有极低的溶解度,在GE中的GE中的1.3×10(7)厘米(-3)。层交换过程有助于有效蚀刻Au层,从而导致在EDS的灵敏度内的残余Au杂质中没有污染的聚麦薄膜。然而,聚-GE薄膜表现出p型半导体行为,其中等掺杂浓度类似于1.3×10(17 )cm(-3),并且由于点而在室温下的1个ωcm类似的低电阻率缺陷引起的受体状态。薄膜在室温下显示出类似于50cm(2)V-1 -s(-1)的迁移率,对于在这种低温下形成的多锗薄膜最高。迁移率的温度依赖性表示在晶界中类似于84meV的高屏障,其用作限制载体传导的主散射机制。

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