首页> 外文会议>Institute of Electrical and Electronics Engineers International Symposium on Power Semiconductor Devices ICs >The optimised design and characterization of 1200 V / 2.0 m? cm2 4H-SiC V-groove trench MOSFETs
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The optimised design and characterization of 1200 V / 2.0 m? cm2 4H-SiC V-groove trench MOSFETs

机译:优化的设计和表征为1200 V / 2.0 m? CM 2 4H-SIC V沟槽沟沟MOSFET

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V-groove trench MOSFETs with the 4H-SiC{0-33-8} face as the trench sidewall for the channel region have been investigated. The on-resistance and breakdown voltage strongly depend on the aperture ratio of the buried p regions. The VMOSFETs with the buried p regions of 71% on a 6-inch wafer exhibited a low specific on-resistance of 2.0 mΩ cm with 1200 V blocking voltage. The threshold voltage is 2.3 V at 175°C, which shows the VMOSFETs have tolerability for an erroneous ignition under high temperature. The switching capability showed low switching losses over DMOSFETs on 4° off 4H-SiC(0001) face and normal operation under fast switching repetitive test (40 Vns). The stability of the threshold voltage was demonstrated by HTGB tests.
机译:已经研究了具有4H-SiC {0-33-8}的V沟槽沟槽MOSFET作为通道区域的沟槽侧壁。导通电阻和击穿电压强烈取决于掩埋P区域的孔径比。带有掩埋P区的VMOSFET在6英寸晶片上的71%的vMOSFET表现出低2.0mΩcm的低特定电阻,具有1200 V阻挡电压。在175℃下阈值电压为2.3V,显示VMOSFET在高温下具有错误点火的可耐受性。开关能力在4H-SiC(0001)面上的4°OFF 4°OFF 4H-SIC(0001)面上和正常操作下的低开关损耗在快速切换重复测试(40 VNS)上。 HTGB测试证明了阈值电压的稳定性。

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