A Review: The Wettability and Oxidation Resistance of Sn-Zn-X Lead-Free Solder Joints

摘要

With the development of lead-free solders, Sn-Zn solder was attracted increasing attention due to its low melting point, cost saving and excellent mechanical properties. However, there are many problems need to resolved, such as poor wettability and oxidation resistance. In order to overcome these shortcomings, more recent studies on Sn-Zn solder have proposed strategies aimed at obtaining a good wettability and solder ability by adding a third or fourth elements, such as In, Ga, P, Bi, Ni, Cr, Ag, Cu, Al and rare earth. This work summarizes the effects of alloying elements to the wettability and oxidation resistance of Sn-Zn lead-free solders.