LEAD-FREE SOLDER ALLOYS AND SOLDER JOINTS THEREOF WITH IMPROVED DROP IMPACT RESISTANCE

摘要

Lead- free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise 0.0-4.0 wt . % of Ag, 0.01-1.5 wt . % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt.%, Y in an amount of 0.001-1.0 wt.%, Ti in an amount of 0.001-0.8 wt.%, and Bi in an amount of 0.01-1.0 wt.%, and the remainder of Sn.