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ANOTHER LOOK AT LEAD-FREE SOLDER JOINT RELIABILITY UNDER RANDOM VIBRATION

机译:在随机振动下,另一种观察无铅焊点可靠性

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In recent years a growing concern for lead-free solder has propelled industry to re-evaluate surface mount technology (SMT) production. This is based on the European Union's reduction of hazardous substances (RoHS) directive for a cleaner environment. Military and Aerospace industries, though they have been given exemption from this directive, are very dependent upon commercial industry that must be RoHS compliant. Therefore RoHS issues are important to Military and Aerospace industries. Commercial industries are not required to meet the rugged environmental standards required for military and aerospace applications. It is necessary for further research to be conducted on commercial lead-free solders (using military standards) that will be used for military applications. The varying properties of lead-free solders as compared to the Tin Lead (SnPb) model have made it so that traditional methods of processing can no longer be utilized, thus raising Diminishing Manufacturing Sources and Material Shortages (DMSMS) concerns within the military and aerospace communities. Lead-free solder properties vary with the percentage of alloy composition, heat treatments and crystallography. Further research is needed in characterizing and creating valid models for lead-free solder joint reliability. The Microelectronics Testing and Technology Obsolescence Program (METTOP) is a small microelectronics testing and research facility located at New Mexico Tech, in Socorro, NM. Our facility has recently started a lead-free solder research program, to assist in mitigating DMSMS issues and concerns regarding reliability-information, or the lack there of, on lead-free solders for use in Military and Aerospace applications. Our initiative is to conduct smaller research projects making contributions to the greater body of knowledge by filling in gaps of current research. Our initial efforts are focused on performing vibration reliability testing of lead-free alloys. This paper documents the most recent results of the research done at New Mexico Tech.
机译:近年来,无铅焊料的越来越担心推动了工业,重新评估表面贴装技术(SMT)生产。这是基于欧盟对清洁环境的危险物质(ROHS)指令的减少。军事和航空航天工业,尽管他们得到了这一指令的豁免,但非常依赖商业行业,这些行业必须符合RoHS。因此,ROHS问题对军事和航空航天行业很重要。商业行业不需要满足军事和航空航天应用所需的崎岖环境标准。有必要进一步研究,以便在商业无铅焊料(使用军事标准)上,这些焊接将用于军事应用。与锡铅(SNPB)模型相比,无铅焊料的不同性质使其已经不再使用了传统的加工方法,从而提高了军事和航空航天内的制造源和材料短缺(DMSMS)缺点(DMSMS)问题。社区。无铅焊料特性随着合金组成,热处理和晶体学的百分比而变化。需要进一步的研究,以表征和创造无铅焊接联合可靠性的有效模型。微电子检测和技术过时计划(Mettop)是位于新墨西哥科技的小型微电子测试和研究设施,在纳米州Socorro。我们的设施最近启动了一个无铅焊接研究计划,协助减轻DMSMS问题和对可靠性信息的关注,或者缺乏用于军事和航空航天应用的无铅焊料。我们的倡议是通过填补目前研究的差距,对更小的研究项目做出贡献,为更大的知识进行贡献。我们的初步努力集中于执行无铅合金的振动可靠性测试。本文介绍了新墨西哥技术的研究结果最新结果。

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