Random vibration reliability of BGA lead-free solder joint

摘要

Solder joint fatigue failure under vibration loading has been a great concern in microelectronic industry. High-cycle fatigue failure of lead-free solder joints has not been adequately addressed, especially under random vibration loading. This study aims to understand the lead-free solder joint behavior of BGA packages under different random vibration loadings. At first, non-contact TV Laser holography technology was adopted to conduct experimental modal analysis of the test vehicle (printed circuit board assembly) in order to understand its dynamic characteristics. Then, its first order natural frequency was used as the center frequency and narrow-band random vibration fatigue tests with different kinds of acceleration power spectral density (PSD) amplitudes were respectively carried out. Electrical continuity through each BGA package is monitored during the vibration event in order to detect the failure of package-to-board interconnects. The typical dynamic voltage histories of failed solder joints were obtained simultaneously. Thirdly, failed solder joints were cross-sectioned and metallurgical analysis was applied to investigate the failure mechanisms of BGA lead-free solder joints under random vibration loading. The results show that the failure mechanisms of BGA lead-free solder joint vary as the acceleration PSD amplitude increases. Solder joint failure locations are changed from the solder bump body of the PCB side to the solder ball neck, finally to the Ni/intermetallic compound (IMC) interface of the package side. The corresponding failure modes are also converted from ductile fracture to brittle fracture with the increase of vibration intensity.