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Failure mechanisms of DC and capacitive RF MEMS switches

机译:DC和电容式RF MEMS开关的故障机制

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Microelectromechanical systems (MEMS) radio frequency (RF) switches hold great promise in a myriad of commercial, aerospace, and military applications including cellular phones and phased array antennas. However, there is limited understanding of the factors determining the performance and reliability of these devices. Fundamental studies of hot-switched DC (gold versus gold) and capacitive (gold versus silicon nitride) MEMS RF switch contacts were conducted in a controlled air environment at MEMS-scale forces using a micro/nanoadhesion apparatus as a switch simulator. This paper reviews key experimental, results from the switch simulator and how they relate to failure mechanisms of MEMS switches. For DC switch contacts, electric current had a profound effect on deformation mechanisms, adhesion, contact resistance (R), and reliability/durability. At low current (1-10 μA), junction growth/force relaxation, slightly higher R, and switching induced adhesion growth were prominent. At high current (1-10 mA), asperity melting, slightly lower R, and shorting were present. Adhesion increased during cycling at low current and was linked to the creation of smooth contact surfaces, increased van der Waals interaction, and chemical bonding. Surface roughening by nanowire formation (which also caused shorting) prevented adhesion at high current. Aging of the contacts in air led to hydrocarbon adsorption and less adhesion. Studies of capacitive switches demonstrated that excessive adhesion was the primary failure mechanism and that both mechanical and electrical effects were contributing factors. The mechanical effect is adhesion growth with cycling due to surface smoothening, which allows increased van der Waals interaction and chemical bonding. The electrical effect on adhesion is due to electrostatic force associated with trapped parasitic charge in the dielectric, and was only observed after operating the switch at 40 V bias and above. The two effects are additive; however, the electrical effect was not present until the surfaces were worn smooth by cycling. Surface smoothening increases the electric field in the dielectric, which results in trapped charges, alterations in electrostatic force, and higher adhesion. Excessive adhesion can explain decreased lifetime at high bias voltage previously reported with actual capacitive MEMS switches. Switch sticking, self actuation, failure to actuate, and self release can all be explained by the experimental results.
机译:微机电系统(MEMS)射频(RF)交换机在包括蜂窝电话和相位阵列天线的商业,航空航天和军用应用中具有巨大的承担。但是,有限地了解确定这些设备的性能和可靠性的因素。热交换式DC(金与金)和电容(金与氮化硅)MEMS RF开关触点的基本研究在MEMS凝块力的受控空气环境中使用微/纳米粘度装置作为开关模拟器进行。本文介绍了关键实验,由开关模拟器结果以及它们与MEMS开关的故障机制相关。对于直流开关触点,电流对变形机构,附着力,接触电阻(R)和可靠性/耐用性具有深远的影响。在低电流(1-10μA),结生长/力松弛,略高的R和切换诱导的粘合生长突出。在高电流(1-10mA),存在粗糙度,略低,r略低,呈短路。在低电流下循环期间粘合力增加,并与平滑接触表面的产生连接,增加了范德华相互作用和化学键合。通过纳米线形成(也导致短路的表面粗糙化,防止在高电流下粘附。在空气中的触点时老化导致烃吸附和较少的粘附性。对电容开关的研究表明,过度粘附是初级故障机制,并且机械和电气效应都有助于因素。由于表面平滑引起的循环,机械效果是粘附生长,这允许van der Wa的相互作用和化学键合。对粘附的电气效应是由于与介电中的捕获寄生电荷相关的静电力,并且仅在操作开关处以40V偏差和上方进行操作后观察到。两种效果是添加剂;然而,在通过循环磨损表面,直到表面磨损电气效果。表面平滑增加电介质中的电场,这导致捕获的电荷,静电力的变化,以及更高的粘附性。过度粘附可以用实际电容MEMS开关在先前报告的高偏置电压下解释寿命下降。切换粘贴,自动驱动,未能致动,自我释放都可以通过实验结果来解释。

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