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机译:Ta_2O_5薄膜中的传输和充电机制,用于电容式RF MEMS开关应用
IMM-CNR, Institute for Microelectronics and Microsystems-Unit of Lecce, National Council of Research, Via Monteroni, 1-73100 Lecce, Italy;
rnIMM-CNR, Institute for Microelectronics and Microsystems-Unit of Lecce, National Council of Research, Via Monteroni, 1-73100 Lecce, Italy;
rnIMM-CNR, Institute for Microelectronics and Microsystems-Unit of Lecce, National Council of Research, Via Monteroni, 1-73100 Lecce, Italy;
rnIMM-CNR, Institute for Microelectronics and Microsystems-Unit of Lecce, National Council of Research, Via Monteroni, 1-73100 Lecce, Italy;
rnIMM-CNR, Institute for Microelectronics and Microsystems-Unit of Lecce, National Council of Research, Via Monteroni, 1-73100 Lecce, Italy;
rnIMM-CNR, Institute for Microelectronics and Microsystems-Unit of Lecce, National Council of Research, Via Monteroni, 1-73100 Lecce, Italy;
机译:Ta_2O_5电容式RF MEMS开关的薄膜
机译:基于RF MEMS电容开关的SIN_X膜充电性能的材料化学计量研究
机译:MEMS电容开关的Y_2O_3介电膜中的充电机制
机译:用于RF-MEMS电容开关的氮化硅膜中的充电过程:沉积方法和薄膜厚度的效果
机译:金薄膜中粘弹性的温度依赖性及其对RF MEMS电容开关中恢复力的影响。
机译:改进了在聚合物树脂上蒸发的金薄膜的附着力:传感表面和MEMS的应用
机译:TA2O5用于电容式RF MEMS开关的薄膜
机译:用于射频mEms电容开关的替代介电薄膜,使用原子层沉积的al2O3 / ZnO合金沉积