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Evaluation of Schottky Barrier Height of Al, Ti, Au, and Ni Contacts to 3C-SiC

机译:Al,Ti,Au和Ni触点的肖特基势垒高度评估3C-SIC

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The Schottky barrier height (SBH) of Al, Ti, Au, and Ni contacts to n- and p-type 3C-SiC is investigated by means of I-V and C-V measurements. All metal contacts to n-(net donor concentration: 1.0 x 10~(16) /cm~3) and p-type (net acceptor concentration: 4 x 10~(16) /cm~3) 3C-SiC show the rectifying I-V characteristics except for Al contact to n-type 3C-SiC. Only Al contact to n-type 3C-SiC shows the ohmic characteristics. As the work function of metal is increased from 4.3 (Ti) to 5.2 (Ni) eV, SBH for n-type 3C-SiC is increased from 0.4 to 0.7 eV and SBH for p-type 3C-SiC is decreased from 2.2 to 1.8 eV. The small change of SBH for 3C-SiC may be correlated to the crystal orientation and the defects on the surface of 3C-SiC.
机译:通过I-V和C-V测量研究了Al,Ti,Au和Ni触点的肖特基势垒高度(SBH)和N-和P型3C-SiC的触点。所有金属触点到N-(净供体浓度:1.0×10〜(16)/ cm〜3)和p型(净受体浓度:4×10〜(16)/ cm〜3)3C-SIC显示整流IV特性除了Al接触N型3C-SiC。只有Al接触N型3C-SiC显示欧姆特征。随着金属的功函数从4.3(Ti)增加到5.2(Ni)EV,对于N型3C-SiC的SBH从0.4〜0.7eV增加,P型3C-SiC的SBH从2.2降至1.8 EV。对于3C-SiC的SBH的小变化可以与晶体取向和3C-SiC表面上的缺陷相关。

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