On the Schottky barrier height lowering effect of Ti3SiC2 in ohmic contacts to p-type 4H-SiC

摘要

In this paper, an experimental investigation into titanium (Ti) / aluminium (Al)-based ohmic contacts to p-type 4H-silicon carbide (SiC) has been presented. Electrical characterisation of the fabricated contacts showed that metal structures with an initial‎ Ti‎ layer‎ yielded ‎the ‎lowest‎ specific‎ contact‎ resistance ‎(ρc), with a mean value of 3.7×10-5 Ω-cm2 being achieved after annealing in argon (Ar) at 1000°C for 2 minutes. Transmission electron microscopy (TEM) analysis illustrated the epitaxial relationship between the 4H-SiC and the as-deposited Ti layer, and, in conjunction with energy dispersive X-ray (EDX)udanalysis, showed that after annealing a ~5 nm thick layer of Ti3SiC2 was present, epitaxially arranged with the 4H-SiC. X-ray diffraction (XRD) analysis showed that the presence of the Ti3SiC2 metallic phase was more prevalent in the samples with Tiudas the initial metal layer annealed at 1000°C, which corresponded with lower specific contact resistance. Fitting of experimental data to a thermionic field emission (TFE) model allowed the Schottky barrier height to be extracted; it was found that the lowest Schottky barrier heights were more prevalent where the most intense Ti3SiC2 phases were observed during XRD analysis.