The continuing demand for smaller, lighter multifunctional portable electronic products has driven the use of miniature components. To satisfy this demand, 01005 chip components are now commercially available. However the implementation for such tiny components into new products presents some design and assembly process challenges. In this study, a test vehicle was designed to investigate the effect of PCB pad design on assembly yield. Process capability of the 01005 test board manufacturing was evaluated. A Design of Experiments (DOE) was used to optimize the solder paste printing based on 3D solder paste inspection. Lead free solder was used for all assembly trials. Several tests were performed to explore the influences of process parameters on placement accuracy and reflow defects. Through the analysis of experimental results and post-reflow inspection for assembly defects, recommendations for PCB design and assembly processes are made.
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