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Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷

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Marina Makrygianni; Filimon Zacharatos; Kostas Andritsos; Ioannis Theodorakos; Dimitris Reppas; Nikolaos Oikonomidis; Christos Spandonidis; Ioanna Zergioti;
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1. TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process [J] . F. Che Ani, A. Jalar, R. Ismail, Journal of Advanced Manufacturing Technology . 2018,第1期

机译：TIO2纳米颗粒增强了无铅96.5Sn–3.0Ag–0.5Cu焊膏，用于回流焊接工艺中的超细封装组装
2. Ultra-fine pitch solder pastes for flip-chip assembly applications - understanding and overcoming sub-process challenges [J] . Steve Dowds Global SMT & Packaging: European Edition (Surface Mount Technology) . 2005,第9期

机译：适用于倒装芯片组装应用的超细间距焊锡膏-了解和克服子工艺挑战
3. The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly [J] . Ani F. Che, Jalar A., Saad A. A., The International Journal of Advanced Manufacturing Technology . 2018,第1a4期

机译：Fe2O3纳米增强囊无铅焊料在超细电子组装中的影响
4. LEAD-FREE SOLDER PASTE DEVELOPMENT FOR ULTRA FINE-PITCH PRINTING AND REFLOW OF 03015 AND 0201 METRIC CHIP COMPONENTS [C] . Takeshi Shirai, Masashige Hayakawa, Shantanu Joshi, SMTA international conference . 2017

机译：03015和0201公制芯片组件的超细间距印刷和回流的无铅焊料膏开发
5. Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly [D] . Pan, Jianbiao 2000

机译：微型BGA和细间距表面贴装组件的锡膏模版印刷建模和工艺优化
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes [O] . Sharma Ashutosh, Mallik Sabuj, Ekere N., 2014

机译：无铅Sn-3Ag-0.5Cu（SAC）焊膏的印刷形态和流变特性
8. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies [R] . Vianco, P. , Rejent, J. , Artaki, I. , 1996

机译：无铅焊料与含铅表面处理的兼容性是电子组件中的可靠性问题

Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components

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