The ability to assess and improve the product reliability is currently one of the basic contemporary engineer tasks. Unfortunately, reliability is a complex problem and requires interdisciplinary knowledge. One of the typical reliability issues concerning electronic packages is failure due to cyclic temperature changes. It is estimated that around 70% of all failures in electronic packages is due to thermal cyclic fatigue. The common task of an engineer dealing with thermal cyclic fatigue is to predict the number of cycles to failure N{sub}f. Fracture and delamination is the primary reason of failure. The presented paper focuses on numerical evaluation of solder joints reliability in reference to thermal cycles. The numerical method of thermal cyclic fatigue evaluation of the typical solder joints in electronic packages is presented. The methods are referenced to different solder material models. Numerical simulations were performed by FEM analysis.
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