An electronic package reliability prediction system is provided with a database having data of shapes, modeling specifications and material characteristics of an electronic package, a parameter setting part, to which the types, sizes, material selection and evaluating conditions of the electronic package are inputted, a modeling part, which generates a simulation model based on the material characteristic data and the size parameters of a material specified by the inputted parameters, a simulation executing part, which performs simulation under the specified conditions based on the simulation model, a simulation result evaluating part, which evaluates the simulation results in the prescribed evaluating conditions and accumulates the evaluation results in an evaluation result database, an evaluation expression generating part, which generates an approximate expression of the evaluation results for the inputted parameters to obtain an evaluation expression, for the simulation to which a plurality of evaluation results are accumulated, and an evaluation predicting part for outputting evaluation prediction results by the evaluation expression for the electronic package whose evaluation expression has been already constructed.
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