An electronic package reliability prediction device that predicts the reliability of electronic packages is a database that holds electronic package shape and modeling specification data and material property data, and electronic package type, dimensions, material selection and evaluation condition parameters A parameter setting unit that accepts input, a modeling unit that generates a simulation model based on the material characteristic data and dimensional parameters specified by the input parameter, a simulation execution unit that performs simulation under specified conditions based on the simulation model, A simulation result evaluation unit that evaluates a simulation result under a predetermined evaluation condition and accumulates it in an evaluation result database, and an evaluation expression by generating an approximate expression of an evaluation result for an input parameter for a plurality of accumulated evaluation results When That an evaluation expression generating unit, for electronic package evaluation expression has already been established, and an evaluation prediction section for outputting an evaluation prediction result by the evaluation formula.
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