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On-state current stress-induced subthreshold I–V instability in SiC DMOSFETs

机译:状态电流应力引起的SiC DMOSFET中的亚阈值I-V不稳定性

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The reliability of SiC DMOSFETs has been studied in the past several years, including gate oxide reliability with time-dependent dielectric breakdown measurements [1–2], and threshold voltage stability with gate-bias and On-state current stress measurements [2–4]. For example, it has been reported that gate-bias stressing causes a time-dependent shift in threshold voltage, and that an On-state current stress causes a slightly larger threshold-voltage instability [4]. Furthermore, it has been observed that an increase in Off-state leakage current can occur at high temperatures but which can be reduced with the application of a negative gate-bias, indicating an increase in subthreshold-voltage leakage current [5]. It has also been reported that the bias-stress induced threshold-voltage instability increases at increasing temperatures for some SiC MOSFET sample sets [6].
机译:在过去几年中研究了SiC DMOSFET的可靠性,包括具有时间相关的介电击穿测量的栅极可靠性[1-2],以及具有栅极偏置的阈值电压稳定性和接通状态电流应力测量[2-4 ]。例如,据报道,栅极 - 偏置应力导致阈值电压的时间依赖性移位,并且导通状态应力导致略大的阈值 - 电压不稳定性[4]。此外,已经观察到,在高温下可能发生偏离漏电流的增加,但是可以通过施加负栅极偏压来减小,这表明亚阈值电压漏电流的增加[5]。还据报道,偏压诱导的阈值 - 电压不稳定性在增加一些SiC MOSFET样品组的温度下增加[6]。

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