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Electrical Isolation of Dislocations in Ge Layers on Si(001) Substrates Through CMOS Compatible Suspended Structures

机译:通过CMOS兼容悬浮结构在Si(001)基板上的Ge层中脱位的电气隔离

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Suspended crystalline Ge semiconductor structures are created on a Si(001) substrate by a combination of epitaxial growth and simple patterning from the front surface using anisotropic underetching. Geometric definition of the surface Ge layer gives access to a range of planes to either retain or etch the underlying Si. The structures are aligned to avoid etch resistive planes in making the suspended regions and to take advantage of these planes to support the structures. The technique is demonstrated by forming suspended microwires, spiderwebs and Van-der Pauw cross structures. We finally report on the low temperature electrical isolation of the undoped Ge layers. This novel isolation method increases the 10° K Ge resistivity to 280Ω-cm, over two orders of magnitude above that of a bulk Ge on Si(001) layer, by removing material containing the underlying misfit dislocation network that otherwise provides the main source of electrical conduction.
机译:通过外延生长的组合和使用各向异性换向从前表面的外延生长和简单的图案化,在Si(001)衬底上产生悬浮的结晶Ge半导体结构。表面GE层的几何定义可以访问到保持或蚀刻底层Si的一系列平面。结构被对准,以避免蚀刻电阻平面制造悬挂区域并利用这些平面以支撑结构。通过形成悬浮的微线,蜘蛛网和van-der Pauw交叉结构来证明该技术。我们终于报告了未掺杂的GE层的低温电气隔离。这种新的隔离方法将10°K的电阻率增加到280Ω-cm,通过去除包含底层的错入位错网络的材料来增加280Ω-cm,以上超过Si(001)层上的散装Ge的级数。否则提供了主要来源的主要来源导电。

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