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Two-step Annealing for Solution-based Metal Induced Crystallization of Amorphous Silicon Films

机译:基于溶液的金属诱导非晶硅膜结晶的两步退火

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Solution-based nickel (Ni)-induced crystallization (S-MIC) of amorphous silicon (a-Si) films has been studied with a two-step annealing process. We especially introduced Ethyl cellulose (EC) into the Ni-salt solution, so the viscous Ni-salt solution can be uniformly spin-coated on the a-Si film prepared by plasma enhanced chemical vapor deposition (PECVD). The annealing temperature can be first set from room temperature (RT) to 400°C and kept at 400°C for 2 h in nitrogen ambience. And then, it is increased from 500°C to 550°C and kept for several hours in the following annealing. The correlations among crystallization, the concentrations of Ni-salt solution and annealing conditions can be discussed. The experimental results show that with the help of the two-step annealing, the a-Si films can be crystallized at a low temperature of 500°C. The crystalline fraction gets up to 81.2% after annealing at 520°C for 2 h and the grain size of the polycrystalline Si film is approximately 0.2 urn. Energy dispersive spectroscopy (EDS) analysis shows that very little Ni metal atoms reside in the crystallized Si film for S-MIC.
机译:基于溶液的镍(Ni) - 诱导的结晶非晶硅(S-MIC)(α-Si)的薄膜进行了研究与两步骤退火工艺。我们特别引入乙基纤维素(EC)到镍盐溶液,所以该粘性镍盐溶液可以是均匀地旋涂在通过等离子体增强化学气相沉积(PECVD)中制备的α-Si膜。退火温度可以是从室温(RT)至400℃的第一组,并保持在400℃下,在氮气气氛2小时。然后,从500℃升高到550℃并保持在以下退火数小时。结晶之间的相关性,的镍盐溶液和退火条件的浓度可进行讨论。实验结果表明,与两步骤退火的帮助下,在a-Si膜可以在500℃的低温下结晶。的结晶级分在520℃下退火2小时,多晶Si膜的晶粒尺寸后可获得最多81.2%大约为0.2瓮。能量色散谱(EDS)分析表明,非常少的Ni金属原子驻留在用于S-MIC结晶Si膜。

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