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How to evaluate the reliability of MEMS devices without standards

机译:如何在没有标准的情况下评估MEMS设备的可靠性

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The standard methodologies currently used for lifetime estimation of microelectronics products rely on the combination of consolidated best practice experience and the knowledge of the manufacturing technology. Indeed, the core physics involved in most solid state device (e.g. transistors) does not change much from one product to another. On the contrary, the large variety of MEMS devices requires a deep understanding of the specific technology they are based on. As a consequence, the failure mechanisms can be even very different between an accelerometer, a micro-mirror or an RF MEMS switch.The present contribution proposes to apply the Physics of Failure approach to estimate the lifetime of MEMS devices, and RF MEMS switches in particular. This methodology takes advantage of the knowledge of the potential failure mode for accelerating the underlying failure mechanism through proper electrical and environmental stimuli. Acceleration factors could be deduced from a parametric study thanks to in-situ monitoring of the devices performance. To assess the reliability of a given device, which could be provided "as is" by the manufacturer, specific testing routines have to be developed and implemented: electrostatic cycling tests, coupled with environmental stresses (temperature, moisture, vibrations, etc.). This paper will then focus on a physical description of the failures to get to an adapted test plan providing the main reliability figures (Time to failure, acceleration factors for instance).
机译:目前用于微电子产品的寿命估计的标准方法依赖于综合最佳实践经验的组合和制造技术的知识。实际上,涉及大多数固态装置(例如晶体管)所涉及的核心物理不会从一个产品到另一个产品的大量变化。相反,各种MEMS器件需要深入了解他们所基于的特定技术。因此,在加速度计,微镜或RF MEMS切换器之间甚至可以非常不同。目前的贡献建议应用故障方法的物理来估计MEMS器件的寿命,并且RF MEMS开关特定。该方法利用了通过适当的电气和环境刺激加速潜在故障模式的潜在故障模式的知识。由于对设备性能的原位监控,可以从参数研究中推导出加速因素。为了评估给定的设备,其可“原样”由生产商,特定的测试程序,必须制定和执行的可靠性:静电循环测试,加上环境应力(温度,湿度,振动等)。然后,本文将重点关注故障的物理描述,以实现适应性的测试计划,提供主要可靠性图(失败时间,例如,加速因子)。

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