首页> 外国专利> Evaluation method of deposition chamber of manufacturing device of organic device, standard mask device and standard substrate used in evaluation method, manufacturing method of standard mask device, and manufacturing apparatus of organic device equipped with vapor deposition chamber evaluated by evaluation method Organic device having deposited layer formed in the deposition chamber evaluated in the evaluation method, and maintenance method of deposition chamber of organic device manufacturing apparatus

Evaluation method of deposition chamber of manufacturing device of organic device, standard mask device and standard substrate used in evaluation method, manufacturing method of standard mask device, and manufacturing apparatus of organic device equipped with vapor deposition chamber evaluated by evaluation method Organic device having deposited layer formed in the deposition chamber evaluated in the evaluation method, and maintenance method of deposition chamber of organic device manufacturing apparatus

机译:用于有机装置的制造装置沉积室的评价方法,标准掩模装置和评估方法的标准衬底,标准掩模装置的制造方法,以及通过沉积层评估的有机装置评价的气相沉积室的有机装置的制造装置 形成在评估方法中评估的沉积室,以及有机装置制造装置的沉积室的维护方法

摘要

Problem to be solved: to provide a method for evaluating the relative position accuracy between a mask device and an electrode substrate of an organic device manufacturing apparatus.Evaluation methodIn the deposition chamberA deposition step of depositing a material on a substrate 110 of a standard substrate including a standard mark 63 through a through hole 56 of a standard mask 50A of a standard mask device to form a deposition layer 130 on the substrate 110 of the standard substrateA delivery step of carrying a standard substrate on which a deposition layer is formed is carried out from a manufacturing apparatusAn observation process for observing the positional relationship between a standard mark and a deposited layer on a standard substrate carried out from a manufacturing device.Selection diagram
机译:要解决的问题:提供一种用于评估掩模装置和有机器件制造装置的电极基板之间的相对位置精度的方法。评估腔室沉积腔室沉积步骤,其在标准衬底的基板110上沉积在包括的基板110上包括 标准标记63通过标准掩模装置的标准掩模50a的通孔56,以在承载形成沉积层的标准基板的标准底壳输送步骤的基板110上形成沉积层130 从制造设备的观察过程中,用于在从制造装置执行的标准衬底上观察标准标记和沉积层之间的位置关系。选择图

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号