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Charge Trapping in Gate-Drain Access Region of AlGaN/GaN MIS-HEMTs after Drain Stress

机译:在排水胁迫后,在AlGaN / GaN Mis-Hemts的栅极排水接入区域中捕获

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In this paper we investigate the drain stress behavior and charge trapping phenomena of GaN-based high electron mobility transistors (HEMTs). We fabricated GaN-on-Si MISHEMTs with different dielectric stacks in the gate and gate drain access region and performed interface characterization and stress measurements for slow traps analysis. Our results show a high dependency of the on-resistance increase on interfaces in the gate-drain access region. The dielectric interfaces near the channel play a significant role for long term high voltage stress and regeneration of the device.
机译:在本文中,我们研究了基于GaN的高电子迁移率晶体管(HEMT)的排水应力行为和电荷捕获现象。我们在栅极和栅极漏极进入区域中使用不同的电介质叠层制造了GaN-On-Si Mishemts,并对慢性陷阱分析进行了界面表征和应力测量。我们的结果显示了栅极 - 漏极进入区域内接口导通电阻增加的高依赖性。频道附近的介电接口对装置的长期高压应力和再生发挥着重要作用。

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