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Doubly exposed patterning characteristics using two alternating phase shift masks

机译:使用两个交替相移掩模的双重暴露的图案化特性

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Double exposure using mutually one-pitch-step shifted alt. PSM's is proposed to eliminate the ⊿CD and CD reversal. By doubly exposing mutually one-pitch-step shifted alt. PSM's, the ⊿CD and CD reversal is observed to disappear. The phase margin of 8° and the undercut margin of 40 nm are obtained for 1.2μm DOF margin. Comparing with alt. PSM, double exposure using mutually one-pitch-step shifted alt. PSM has larger margin in undercut and phase, which allows mask to be manufactured easily. The alignment tolerance is calculated to be 75 nm which is enough compared with recent lithographic systems. By doubly exposing mutually one-pitch-step shifted alt. PSM, the equal CD's of 141 nm and 142 nm were observed. Our double exposing technique proved to have large advantages over alt. PSM not only in removal of ⊿CD and CD reversal, but also in the phase and undercut margin.
机译:双曝光使用相互单位步进移位的ALT。普华永道建议消除CD和CD逆转。通过双重曝光相互曝光的一步级移位。 PSM,观察到⊿CD和CD逆转消失。获得8°的相裕度和40nm的底切裕度获得1.2μm的余量。与alt相比。 PSM,双曝光使用相互单位阶跃移位的ALT。 PSM在底切和相位具有较大的余量,允许容易地制造面罩。对准公差计算为75nm,其与最近的光刻系统相比足够。通过双重曝光相互曝光的一步级移位。 PSM,观察到141nm和142nm的相等CD。我们的双重曝光技术证明了ALT的巨大优势。 PSM不仅在删除⊿CD和CD逆转,而且在阶段和削减边缘。

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