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Properties of n-and p-channel mosfets with ultrathin rtcvd oxynitride gatedielectrics

机译:具有超薄RTCVD氧氮化物凸晶电极的N-和P沟道MOSFET的性质

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A detailed study of the electrical properties of n-channel and p-channel MOSFETs with ultra-thin (2.0 nm to 3.0 nm) N_2O annealed Rapid Thermal Chemical Vapor Deposited (RTCVD) oxynitrides and Rapid Thermal Oxides (RTO) is presented. The characterization methodologies for capacitance-voltage, effective mobility, tunneling and reliability were critically analyzed to provide meaningful comparisons of the dielectrics. The results of the characterization indicate that an ultra-thin RTCVD oxynitride with N_2O anneal stops boron penetration, has comparable channel mobility and reliability, and has lower tunnel current as compared to RTO.
机译:提出了具有超薄(2.0nm至3.0nm)N_2O退火的快速热化学气相沉积(RTCVD)氧氮化物和快速热氧化物(RTO)的N沟道和P沟道MOSFET的电特性的详细研究。用于电容 - 电压,有效迁移率,隧道和可靠性的表征方法,以提供有意义的电介质比较。表征的结果表明,具有N_2O退火的超薄RTCVD氧氮化物停止硼渗透,具有相当的信道移动性和可靠性,并且与RTO相比具有较低的隧道电流。

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