Ultrathin GeSn p-channel MOSFETs grown directly on Si(111) substrate using solid phase epitaxy

摘要

Ultrathin GeSn layers with a thickness of 5.5 nm are fabricated on a Si(111) substrate by solid phase epitaxy (SPE) of amorphous GeSn layers with Sn concentrations up to 6.7%. We demonstrate well-behaved depletion-mode operation of GeSn p-channel metal–oxide–semiconductor field-effect transistors (pMOSFETs) with an on/off ratio of more than 1000 owing to the ultrathin GeSn channel layer (5.5 nm). It is found that the on current increases significantly with increasing Sn concentration at the same gate overdrive, attributed to an increasing substitutional Sn incorporation in Ge. The GeSn (6.7%) layer sample shows approximately 90% enhancement in hole mobility in comparison with a pure Ge channel on Si.